An Efficient Metal-Core Printed Circuit Board With a Copper-Filled Through (Blind) Hole for Light-Emitting Diodes

A Cu-filled through (blind) hole was formed in a metal-core printed circuit board (MCPCB) by drilling a hole underneath the chip pad, followed by hole filling using copper electroplating. This Cu-filled through (blind) hole acts as a superior heat-dissipation route, which directly and efficiently re...

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Bibliographic Details
Published inIEEE electron device letters Vol. 34; no. 1; pp. 105 - 107
Main Authors Wu, Je-Yi, Chen, Chih-Ming, Horng, Ray-Hua, Wuu, Dong-Sing
Format Journal Article
LanguageEnglish
Published IEEE 01.01.2013
Subjects
Dielectrics
Heating
Light emitting diodes
Light-emitting diodes (LEDs)
packaging
Thermal analysis
Thermal conductivity
Thermal resistance
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Summary:A Cu-filled through (blind) hole was formed in a metal-core printed circuit board (MCPCB) by drilling a hole underneath the chip pad, followed by hole filling using copper electroplating. This Cu-filled through (blind) hole acts as a superior heat-dissipation route, which directly and efficiently removes the heat generated by the light-emitting diode (LED) chip. Compared with a conventional MCPCB, the MCPCB with a Cu-filled through (blind) hole significantly reduces the peak surface temperature of the LED chip from 46 °C to 39 °C and the total thermal resistance from 8.9 to 2.8 K/W.
ISSN:0741-3106
1558-0563
DOI:10.1109/LED.2012.2225404