Study on the optimization of bending-vibration coupling stress of QFN solder joints based on Taguchi orthogonal experimental design and Harris Hawks Optimization algorithm

• Published in: Microelectronics and reliability Vol. 173; p. 115839
• Main Authors: Wei, Jisheng, Huang, Chunyue, Gao, Chao, Wang, Gui
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.10.2025
• Subjects: Bending-vibration coupling; Harris Hawks Optimization; QFN solder joints; Structural parameters optimization; Taguchi Orthogonal; QFN solder joints; Structural parameters optimization; Taguchi Orthogonal; Bending-vibration coupling; Harris Hawks Optimization
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2025.115839

A three-dimensional finite element analysis model of QFN (Quad Flat No-Lead package) solder joints was established, and stress–strain analysis under bending-vibration coupling conditions was conducted. A validation experiment for measuring the bending-vibration coupled strain of QFN solder joints was designed and successfully carried out. Based on Taguchi Orthogonal Experimental Design and analysis of variance and range, the effects of pad length, pad width, and solder joint standoff height on the bending-vibration coupled stress and strain of solder joints were investigated. Taking the bending-vibration coupled stress as the optimization objective, the structural parameters of the solder joints were optimized using the Harris Hawks Optimization (HHO) algorithm. The results show that the solder joint standoff height has the greatest influence on the bending-vibration coupled stress. The optimal parameter combination for the QFN solder joints is: pad length of 0.62 mm, pad width of 0.21 mm, and solder joint standoff height of 0.09 mm. The optimized parameter combination reduced the bending-vibration coupled stress by 34.8%. These findings provide theoretical guidance for reducing the bending-vibration coupled stress in QFN solder joints. •3D QFN solder model validated for bending-vibration stress analysis.•Solder joint standoff height dominates bending-vibration stress.•HHO Algorithm optimizes QFN solder geometry for reliability enhancement.