Investigation of resistive switching behaviours in WO3-based RRAM devices

In this paper, a WO3-based resistive random access memory device composed of a thin film of WO3 sandwiched between a copper top and a platinum bottom electrodes is fabricated by electron beam evaporation at room temperature. The reproducible resistive switching, low power consumption, multilevel sto...

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Bibliographic Details
Published inChinese physics B Vol. 20; no. 1; pp. 589 - 595
Main Author 李颖弢 龙世兵 吕杭炳 刘琦 王琴 王艳 张森 连文泰 刘肃 刘明
Format Journal Article
LanguageEnglish
Published IOP Publishing 2011
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Summary:In this paper, a WO3-based resistive random access memory device composed of a thin film of WO3 sandwiched between a copper top and a platinum bottom electrodes is fabricated by electron beam evaporation at room temperature. The reproducible resistive switching, low power consumption, multilevel storage possibility, and good data retention characteristics demonstrate that the Cu/WO3/Pt memory device is very promising for future nonvolatile memory applications. The formation and rupture of localised conductive filaments is suggested to be responsible for the observed resistive switching behaviours.
Bibliography:resistive random access memory, resistive switching, nonvolatile, WO3
TM26
TP368.32
11-5639/O4
ISSN:1674-1056
2058-3834
DOI:10.1088/1674-1056/20/1/017305