Localized Bathless Metal-Composite Plating via Electrostamping

• Published in: Journal of visualized experiments no. 163
• Main Authors: Townsend, Troy K, Hancock, Juliana, Russell, Carter, Shaw, Jason P
• Format: Journal Article
• Language: English
• Published: United States 22.09.2020
• Subjects: Electric Conductivity; Electrochemistry; Electrodes; Electroplating - methods; Image Processing, Computer-Assisted; Nickel - chemistry; Spectrometry, Fluorescence; Wettability
• ISSN: 1940-087X; 1940-087X
• DOI: 10.3791/61484

Composite plating with particles embedded into the metal matrix can enhance the properties of the metal coating to make it more or less conductive, hard, durable, lubricated or fluorescent. However, it can be more challenging than metal plating, because the composite particles are either 1) not charged so they do not have a strong electrostatic attraction to the cathode, 2) are hygroscopic and are blocked by a hydration shell, or 3) too large to remain stagnate at the cathode while stirring. Here, we describe the details of a bathless plating method that involves anode and cathode nickel plates sandwiching an aqueous concentrated electrolyte paste containing large hygroscopic phosphorescent particles and a hydrophilic membrane. After applying a potential, the nickel metal is deposited around the stagnant phosphor particles, trapping them in the film. The composite coatings are characterized by optical microscopy for film roughness, thickness and composite surface loading. In addition, fluorescence spectroscopy can be used to quantify the illumination brightness of these films to assess the effects of various current densities, coating duration and phosphor loading.