Performance comparison of radiation-hardened layout techniques

Total ionizing dose (TID) effect and single event effect (SEE) from space may cause serious effects on bulk silicon and silicon on insulator (SOl) devices, so designers must pay much attention to these bad effects to achieve better performance. This paper presents different radiation-hardened layout...

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Published inJournal of semiconductors Vol. 35; no. 6; pp. 119 - 122
Main Author 吕灵娟 刘汝萍 林敏 桑泽华 邹世昌 杨根庆
Format Journal Article
LanguageEnglish
Published 01.06.2014
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ISSN1674-4926
DOI10.1088/1674-4926/35/6/065006

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Abstract Total ionizing dose (TID) effect and single event effect (SEE) from space may cause serious effects on bulk silicon and silicon on insulator (SOl) devices, so designers must pay much attention to these bad effects to achieve better performance. This paper presents different radiation-hardened layout techniques to mitigate TID and SEE effect on bulk silicon and SOl device and their corresponding advantages and disadvantages are studied in detail. Under 0.13μm bulk silicon and SOl process technology, performance comparisons of two different kinds of DFF circuit are made, of which one kind is only hardened in layout (protection ring for bulk silicon DFF, T-gate for SO! DFF), while the other kind is also hardened in schematic such as DICE structure. The result shows that static power and leakage of SOI DFF is lower than that of bulk silicon DFF, while SOI DFF with T-gate is a little slower than bulk silicon DFF with protection ring, which will provide useful guidance for radiation-hardened circuit and layout design.
AbstractList Total ionizing dose (TID) effect and single event effect (SEE) from space may cause serious effects on bulk silicon and silicon on insulator (SOl) devices, so designers must pay much attention to these bad effects to achieve better performance. This paper presents different radiation-hardened layout techniques to mitigate TID and SEE effect on bulk silicon and SOl device and their corresponding advantages and disadvantages are studied in detail. Under 0.13μm bulk silicon and SOl process technology, performance comparisons of two different kinds of DFF circuit are made, of which one kind is only hardened in layout (protection ring for bulk silicon DFF, T-gate for SO! DFF), while the other kind is also hardened in schematic such as DICE structure. The result shows that static power and leakage of SOI DFF is lower than that of bulk silicon DFF, while SOI DFF with T-gate is a little slower than bulk silicon DFF with protection ring, which will provide useful guidance for radiation-hardened circuit and layout design.
Total ionizing dose (TID) effect and single event effect (SEE) from space may cause serious effects on bulk silicon and silicon on insulator (SOI) devices, so designers must pay much attention to these bad effects to achieve better performance. This paper presents different radiation-hardened layout techniques to mitigate TID and SEE effect on bulk silicon and SOI device and their corresponding advantages and disadvantages are studied in detail. Under 0.13 mu m bulk silicon and SOI process technology, performance comparisons of two different kinds of DFF circuit are made, of which one kind is only hardened in layout (protection ring for bulk silicon DFF, T-gate for SOI DFF), while the other kind is also hardened in schematic such as DICE structure. The result shows that static power and leakage of SOI DFF is lower than that of bulk silicon DFF, while SOI DFF with T-gate is a little slower than bulk silicon DFF with protection ring, which will provide useful guidance for radiation-hardened circuit and layout design.
Author 吕灵娟 刘汝萍 林敏 桑泽华 邹世昌 杨根庆
AuthorAffiliation The State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China University of Chinese Academy of Sciences, Beijing 100049, China
Author_xml – sequence: 1
  fullname: 吕灵娟 刘汝萍 林敏 桑泽华 邹世昌 杨根庆
BookMark eNo9kMtqwzAURLVIoUnbTyi4u25cS9bL2hRK6AsC7aJdC0W6TlRsKZGcRf6-NglZXRhm5g5ngWYhBkDonuAngpumIkKykqlaVJRXosKCYyxmaH7Rr9Ei579RlIyROXr-htTG1JtgobCx35nkcwxFbItknDeDj6HcmuQggCs6c4yHoRjAboPfHyDfoqvWdBnuzvcG_b69_iw_ytXX--fyZVXaWuChFBIMXUsqnaASFGdgjVFKtnIcgikhdUtdXdeqkSAbQ5zl4_K1xK2S3BFKb9DjqXeX4vR30L3PFrrOBIiHrInklCnGmBit_GS1KeacoNW75HuTjppgPTHSEws9sdCUa6FPjMbcwzm3jWGz92FzCTKlGG4op_-aGWhp
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10.1109/TNS.2003.813129
10.1109/TNS.2008.920260
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10.1109/23.819140
10.1109/TNS.2008.2007119
10.1109/TNS.2005.860717
10.1109/TED.2011.2173201
ContentType Journal Article
DBID 2RA
92L
CQIGP
W92
~WA
AAYXX
CITATION
7SP
7U5
8FD
L7M
DOI 10.1088/1674-4926/35/6/065006
DatabaseName 中文期刊服务平台
中文科技期刊数据库-CALIS站点
维普中文期刊数据库
中文科技期刊数据库-工程技术
中文科技期刊数据库- 镜像站点
CrossRef
Electronics & Communications Abstracts
Solid State and Superconductivity Abstracts
Technology Research Database
Advanced Technologies Database with Aerospace
DatabaseTitle CrossRef
Solid State and Superconductivity Abstracts
Technology Research Database
Advanced Technologies Database with Aerospace
Electronics & Communications Abstracts
DatabaseTitleList
Solid State and Superconductivity Abstracts
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
Physics
DocumentTitleAlternate Performance comparison of radiation-hardened layout techniques
EndPage 122
ExternalDocumentID 10_1088_1674_4926_35_6_065006
49940835
GroupedDBID 02O
042
1WK
2B.
2C0
2RA
4.4
5B3
5VR
5VS
7.M
92H
92I
92L
92R
93N
AAGCD
AAJIO
AALHV
AATNI
ABHWH
ACAFW
ACGFO
ACGFS
ACHIP
AEFHF
AFUIB
AFYNE
AHSEE
AKPSB
ALMA_UNASSIGNED_HOLDINGS
ASPBG
AVWKF
AZFZN
BBWZM
CCEZO
CEBXE
CHBEP
CJUJL
CQIGP
CRLBU
CUBFJ
CW9
EBS
EDWGO
EJD
EQZZN
FA0
IJHAN
IOP
IZVLO
JCGBZ
KNG
KOT
M45
N5L
NS0
NT-
NT.
PJBAE
Q02
RIN
RNS
ROL
RPA
RW3
SY9
TCJ
TGT
W28
W92
~WA
-SI
-S~
5XA
5XJ
AAYXX
ACARI
AERVB
AGQPQ
AOAED
ARNYC
CAJEI
CITATION
Q--
TGMPQ
U1G
U5S
7SP
7U5
8FD
AEINN
L7M
ID FETCH-LOGICAL-c260t-67ea3b737d637e954ecaa997f700603112f3d222987e78a1dc5065b70f975d133
ISSN 1674-4926
IngestDate Fri Sep 05 13:33:48 EDT 2025
Tue Jul 01 03:20:29 EDT 2025
Wed Feb 14 10:36:59 EST 2024
IsPeerReviewed true
IsScholarly true
Issue 6
Language English
License http://iopscience.iop.org/info/page/text-and-data-mining
http://iopscience.iop.org/page/copyright
LinkModel OpenURL
MergedId FETCHMERGED-LOGICAL-c260t-67ea3b737d637e954ecaa997f700603112f3d222987e78a1dc5065b70f975d133
Notes total ionizing dose effect; single event effect; bulk silicon; silicon on insulator; radiation-hardened layout techniques
Lu Lingjuan, Liu Ruping, Lin Min, Sang Zehua, Zou Shichang, Yang Genqing 1 The State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China 2 University of Chinese Academy of Sciences, Beijing 100049, China
11-5781/TN
Total ionizing dose (TID) effect and single event effect (SEE) from space may cause serious effects on bulk silicon and silicon on insulator (SOl) devices, so designers must pay much attention to these bad effects to achieve better performance. This paper presents different radiation-hardened layout techniques to mitigate TID and SEE effect on bulk silicon and SOl device and their corresponding advantages and disadvantages are studied in detail. Under 0.13μm bulk silicon and SOl process technology, performance comparisons of two different kinds of DFF circuit are made, of which one kind is only hardened in layout (protection ring for bulk silicon DFF, T-gate for SO! DFF), while the other kind is also hardened in schematic such as DICE structure. The result shows that static power and leakage of SOI DFF is lower than that of bulk silicon DFF, while SOI DFF with T-gate is a little slower than bulk silicon DFF with protection ring, which will provide useful guidance for radiation-hardened circuit and layout design.
ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
PQID 1753494446
PQPubID 23500
PageCount 4
ParticipantIDs proquest_miscellaneous_1753494446
crossref_primary_10_1088_1674_4926_35_6_065006
chongqing_primary_49940835
ProviderPackageCode CITATION
AAYXX
PublicationCentury 2000
PublicationDate 2014-06-01
PublicationDateYYYYMMDD 2014-06-01
PublicationDate_xml – month: 06
  year: 2014
  text: 2014-06-01
  day: 01
PublicationDecade 2010
PublicationTitle Journal of semiconductors
PublicationTitleAlternate Chinese Journal of Semiconductors
PublicationYear 2014
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10
References_xml – start-page: 1
  year: 2005
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– ident: 6
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SSID ssj0067441
Score 1.9256548
Snippet Total ionizing dose (TID) effect and single event effect (SEE) from space may cause serious effects on bulk silicon and silicon on insulator (SOl) devices, so...
Total ionizing dose (TID) effect and single event effect (SEE) from space may cause serious effects on bulk silicon and silicon on insulator (SOI) devices, so...
SourceID proquest
crossref
chongqing
SourceType Aggregation Database
Index Database
Publisher
StartPage 119
SubjectTerms Circuits
Devices
DFF
Hardening
Insulators
Leakage
Performance assessment
Semiconductors
Silicon
Single Event Effects
单粒子效应
性能对比
性能比较
技术
抗辐射
绝缘体上硅
设计人员
Title Performance comparison of radiation-hardened layout techniques
URI http://lib.cqvip.com/qk/94689X/201406/49940835.html
https://www.proquest.com/docview/1753494446
Volume 35
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwnV3dSxwxEA9XpVAfSrUtntWyhb7Jencmm2RfKiKKylWlvYOjLyGbzfqB7Frv9qH9653JfkVswZaFZZlbEm5mdmaSmfmFkM9DQ2WUUh4aPrQhi2UE31zKQim5yYwRklnM6H4948dTdjqLZr3enle1VC6SHfP7j30l_yNVoIFcsUv2HyTbDgoEeAb5wh0kDPdnyfjCq_o3_oGC2_cIOYATh9hVBfYs3b7Vv7AGuQVtnf8lLp1juXyRIw5s0aV6xmW9gr-8Kb0ynmtH_lbeNR7QEeuC_Pa17_Wm9A97VWp_n2HEunqo2jRywUKEF_RtZwU1UuuIbwgx8htyz61ifRWSqp6eJ4YbjB3uITRzwDNF0AuXXPKG8uGyz87V0XQ8VpPD2eQFWd4VwuXpT84vGlcMo7mjS9thmxYuWPW3tAGNBnxQTYIAG1dFfvkTmPY4UHnsp13wMXlDXtfSCfYrFVglPZuvkRUPS3KNvHS1vGb-lnzx1CLo1CIosuCpWgSVWgSdWrwj06PDycFxWB-TERpYjC5CLqymiaAi5VTYOGLWaB3HIhMItkMhoM5oise2S2GF1KPURPBvEzHMYhGlI0rfk6W8yO06CRLwfCLVejfjlJmMa24k03DJkY6zmPXJRssfdVfBoShYMzMM5Ptkp2FY-5srcZBSIbcVclvRSHFVcbtPPjVsVWDUMFOlc1uUc4XwsSxmjPGNZ7zzgbzqFHaTLC3uS7sFoeIi-ejU4QFGJWRD
linkProvider IOP Publishing
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Performance+comparison+of+radiation-hardened+layout+techniques&rft.jtitle=Journal+of+semiconductors&rft.au=Lu%2C+Lingjuan&rft.au=Liu%2C+Ruping&rft.au=Lin%2C+Min&rft.au=Sang%2C+Zehua&rft.date=2014-06-01&rft.issn=1674-4926&rft.volume=35&rft.issue=6&rft.spage=065006&rft.epage=1-065006-4&rft_id=info:doi/10.1088%2F1674-4926%2F35%2F6%2F065006&rft.externalDBID=NO_FULL_TEXT
thumbnail_s http://utb.summon.serialssolutions.com/2.0.0/image/custom?url=http%3A%2F%2Fimage.cqvip.com%2Fvip1000%2Fqk%2F94689X%2F94689X.jpg