The Use of Test Structures to Perform Chip Level Characterization Studies of Ni and NiFe Electrochemical Deposition

This paper describes the first use of test structures designed to characterize the fundamental properties of nickel and nickel-iron alloy films deposited using electroplating. The structures are used to perform a chip-level investigation into the effects of electrolyte bath composition on the charac...

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Bibliographic Details
Published inIEEE transactions on semiconductor manufacturing Vol. 30; no. 3; pp. 243 - 253
Main Authors Murray, Jeremy, Perry, Richard, Terry, Jonathan G., Smith, Stewart, Mount, Andy, Walton, Anthony J.
Format Journal Article
LanguageEnglish
Published IEEE 01.08.2017
Subjects
Electrodeposition
MEMS
Nickel
NiFe
optimisation
Permalloy
Plating
Semiconductor device measurement
Strain
Stress
test structures
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Summary:This paper describes the first use of test structures designed to characterize the fundamental properties of nickel and nickel-iron alloy films deposited using electroplating. The structures are used to perform a chip-level investigation into the effects of electrolyte bath composition on the characteristics of deposited films. The advantage of this methodology is that each electrolyte change does not require the replacement of the large volume bath associated with wafer scale manufacturing investigations, thereby, making the characterisation and optimization of electroplating baths far less time consuming, and considerably more cost effective.
ISSN:0894-6507
1558-2345
DOI:10.1109/TSM.2017.2726442