The Nature and Rate of Creepage of Copper Sulfide Tarnish Films over Gold
Tarnish films that form on Cu surfaces at high humidity can creep over adjoining Au surfaces, causing increases in the contact resistance of the Au. In many cases, however, when Au-plated contacts having exposed areas of Cu are removed from equipment used for extended periods of time in environments...
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| Published in | Journal of the Electrochemical Society Vol. 128; no. 6; pp. 1321 - 1326 |
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| Main Author | |
| Format | Journal Article |
| Language | English |
| Published |
01.06.1981
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| Online Access | Get full text |
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| Summary: | Tarnish films that form on Cu surfaces at high humidity can creep over adjoining Au surfaces, causing increases in the contact resistance of the Au. In many cases, however, when Au-plated contacts having exposed areas of Cu are removed from equipment used for extended periods of time in environments known to contain sulfiding compounds, there has been little or no evidence of creepage. This protection against tarnish is caused by a naturally formed oxide and has been duplicated in the laboratory. When copper sulfide tarnish films do creep over Au surfaces, distinctive periodic bands are formed. The humidity dependence of the rate and max. distance of the creepage have been studied.13 refs.--AA |
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| Bibliography: | ObjectType-Article-2 SourceType-Scholarly Journals-1 ObjectType-Feature-1 content type line 23 |
| ISSN: | 0013-4651 1945-7111 |
| DOI: | 10.1149/1.2127628 |