Reaction of nanocrystalline Cu-Sn alloy with Ga-In-Sn eutectic

An extended solid solution of Cu-20%wtSn with a lattice parameter of 0.3715 nm and a crystalline grain sizes D ranging from 30-7 nm was obtained by mechanical alloying. The reaction rate for the formation of CuGa 2 due to the interaction of Cu-20%wtSn with a Ga-In-Sn liquid at room temperature incre...

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Published inMaterials science & engineering. A, Structural materials : properties, microstructure and processing Vol. 217; pp. 277 - 280
Main Authors Ivanov, E., Patton, V., Grigoiyeva, T.F.
Format Journal Article
LanguageEnglish
Published Elsevier B.V 30.10.1996
Subjects
Ga-In-Sn eutectic
Nanocrystalline Cu-Sn
Nanocrystalline Cu-Sn
Ga-In-Sn eutectic
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Summary:An extended solid solution of Cu-20%wtSn with a lattice parameter of 0.3715 nm and a crystalline grain sizes D ranging from 30-7 nm was obtained by mechanical alloying. The reaction rate for the formation of CuGa 2 due to the interaction of Cu-20%wtSn with a Ga-In-Sn liquid at room temperature increased significantly when D decreased to 7 nm. A mechanical alloying process was used to control the reactivity of the nanocrystalline solid solutions, used as components in the low temperature solder pastes.
ISSN:0921-5093
1873-4936
DOI:10.1016/S0921-5093(96)10366-X