A rapid technique for assessing the moisture ingress susceptibility of plastic-encapsulated integrated circuits
The equipment and associated methodology of a new technique for checking the susceptibility of plastic‐encapsulated ICs to moisture ingress is presented. The basis of the new technique is to immerse unbiased ICs in a salt solution and to subject them to high temperatures (in the range 120°C to 175°C...
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| Published in | Quality and reliability engineering international Vol. 3; no. 3; pp. 185 - 193 |
|---|---|
| Main Authors | , |
| Format | Journal Article |
| Language | English |
| Published |
Chichester
Wiley Subscription Services, Inc., A Wiley Company
01.07.1987
Wiley |
| Subjects | |
| Online Access | Get full text |
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| Abstract | The equipment and associated methodology of a new technique for checking the susceptibility of plastic‐encapsulated ICs to moisture ingress is presented. The basis of the new technique is to immerse unbiased ICs in a salt solution and to subject them to high temperatures (in the range 120°C to 175°C) and to high pressures (2 to 9 atmospheres). At the highest temperature, results can be obtained within a few hours, although a 20 h test at 165°C is suggested as a screen for components. The test is extremely simple to carry out and a testing facility can be quickly established. Using CMOS components from five different vendors, good agreement has been obtained between the results from the new test and the results from a biased 85°C/85 percent RH test. |
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| AbstractList | The equipment and associated methodology of a new technique for checking the susceptibility of plastic‐encapsulated ICs to moisture ingress is presented. The basis of the new technique is to immerse unbiased ICs in a salt solution and to subject them to high temperatures (in the range 120°C to 175°C) and to high pressures (2 to 9 atmospheres). At the highest temperature, results can be obtained within a few hours, although a 20 h test at 165°C is suggested as a screen for components. The test is extremely simple to carry out and a testing facility can be quickly established. Using CMOS components from five different vendors, good agreement has been obtained between the results from the new test and the results from a biased 85°C/85 percent RH test. The equipment and associated methodology of a new technique for checking the susceptibility of plastic-encapsulated ICs to moisture ingress is presented. The basis of the new technique is to immerse unbiased ICs in a salt solution and to subject them to high temperatures (in the range 120 to 175 deg C) and to high pressures (2 to 9 atm). At the highest temperature, results can be obtained within a few hours, although a 20 h test at 165 deg C is suggested as a screen for components. The test is extremely simple to carry out and a testing facility can be quickly established. Using CMOS components from five different vendors, good agreement has been obtained between the results from the new test and the results from a biased 85 deg C/85 percent RH test. 23 ref.--AA |
| Author | Shaw, R. N. Chwastek, E. J. |
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| Cites_doi | 10.1109/IRPS.1981.362972 10.1109/IRPS.1983.361964 10.1109/IRPS.1983.361988 10.1109/IRPS.1982.361941 10.1149/1.2134003 10.1109/IRPS.1985.362090 10.1007/978-94-009-4942-3 10.1109/IRPS.1979.362880 10.1109/IRPS.1985.362097 |
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| Keywords | Processing control Encapsulation Lifetime Integrated circuit Package Plastics Moisture test |
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| References | C. E. Browing, 'The mechanisms of elevated temperature property losses in high performance structural epoxy resin matrix materials after exposure to high humidity environments', Polymer Engineering and Science, 18, 1, 16-24 (1978). M. T. Goosey (ed.), Plastics for Electronics, Elsevier Applied Science, Amsterdam, 1985. F. Fantini and C. Morandi, 'Failure modes and mechanisms for VLSI ICs-a review', IEE Proceedings, 132, Pt. G. (3), 74-81 (1985). Z. A. Foroulis and M. J. Thubrikar, 'On the kinetics of the breakdown of passivity of preanodized aluminium by chloride ions', Journal of Electrochemical Society: Electrochemical Science and Technology, Vol. 122, No. 10 pages 1296-1301. 1975. R. W. Lawson, 'A review of the status of plastic encapsulated semiconductor component reliability', British Telecom Technical Journal, 2, 95-111 (1984). P. W. Peterson, 'The performance of plastic-encapsulated CMOS Microcircuits in a humid environment', IEEE CHMT 2, 422-427 (1979). 1984; 2 1986 1985 1978; 18 1984 1983 1979; 2 1975; 122 1982 1981 1979 1985; 132 1977 Peterson P. W. (e_1_2_1_12_2) 1979; 2 Browing C. E. (e_1_2_1_22_2) 1978; 18 Fantini F. (e_1_2_1_3_2) 1985; 132 Lawson R. W. (e_1_2_1_6_2) 1984; 2 e_1_2_1_7_2 e_1_2_1_4_2 e_1_2_1_5_2 e_1_2_1_2_2 e_1_2_1_11_2 e_1_2_1_23_2 e_1_2_1_20_2 e_1_2_1_10_2 e_1_2_1_21_2 e_1_2_1_15_2 e_1_2_1_16_2 e_1_2_1_13_2 e_1_2_1_24_2 e_1_2_1_14_2 e_1_2_1_19_2 e_1_2_1_8_2 e_1_2_1_17_2 e_1_2_1_9_2 e_1_2_1_18_2 |
| References_xml | – reference: C. E. Browing, 'The mechanisms of elevated temperature property losses in high performance structural epoxy resin matrix materials after exposure to high humidity environments', Polymer Engineering and Science, 18, 1, 16-24 (1978). – reference: Z. A. Foroulis and M. J. Thubrikar, 'On the kinetics of the breakdown of passivity of preanodized aluminium by chloride ions', Journal of Electrochemical Society: Electrochemical Science and Technology, Vol. 122, No. 10 pages 1296-1301. 1975. – reference: F. Fantini and C. Morandi, 'Failure modes and mechanisms for VLSI ICs-a review', IEE Proceedings, 132, Pt. G. (3), 74-81 (1985). – reference: R. W. Lawson, 'A review of the status of plastic encapsulated semiconductor component reliability', British Telecom Technical Journal, 2, 95-111 (1984). – reference: M. T. Goosey (ed.), Plastics for Electronics, Elsevier Applied Science, Amsterdam, 1985. – reference: P. W. Peterson, 'The performance of plastic-encapsulated CMOS Microcircuits in a humid environment', IEEE CHMT 2, 422-427 (1979). – year: 1985 – start-page: 458 year: 1984 end-page: 462 – start-page: 229 year: 1983 end-page: 234 – start-page: 182 year: 1977 end-page: 187 – start-page: 245 year: 1983 end-page: 252 – volume: 132 start-page: 74 issue: 3 year: 1985 end-page: 81 article-title: Failure modes and mechanisms for VLSI ICs—a review publication-title: IEE Proceedings – start-page: 48 year: 1981 end-page: 51 – volume: 2 start-page: 95 year: 1984 end-page: 111 article-title: A review of the status of plastic encapsulated semiconductor component reliability publication-title: British Telecom Technical Journal – start-page: 75 year: 1981 end-page: 80 – start-page: 118 year: 1979 end-page: 126 – volume: 2 start-page: 422 year: 1979 end-page: 427 article-title: The performance of plastic‐encapsulated CMOS Microcircuits in a humid environment publication-title: IEEE CHMT – start-page: 192 year: 1985 end-page: 197 – start-page: 73 year: 1983 end-page: 82 – start-page: 132 year: 1986 end-page: 137 – volume: 122 start-page: 1296 issue: 10 year: 1975 end-page: 1301 article-title: On the kinetics of the breakdown of passivity of preanodized aluminium by chloride ions publication-title: Journal of Electrochemical Society: Electrochemical Science and Technology – start-page: 268 year: 1982 end-page: 271 – start-page: 65 year: 1982 end-page: 72 – start-page: 148 year: 1985 end-page: 152 – start-page: 287 year: 1982 end-page: 298 – volume: 18 start-page: 1 year: 1978 end-page: 24 article-title: The mechanisms of elevated temperature property losses in high performance structural epoxy resin matrix materials after exposure to high humidity environments publication-title: Polymer Engineering and Science – ident: e_1_2_1_7_2 doi: 10.1109/IRPS.1981.362972 – ident: e_1_2_1_16_2 doi: 10.1109/IRPS.1983.361964 – ident: e_1_2_1_17_2 – ident: e_1_2_1_21_2 – volume: 2 start-page: 422 year: 1979 ident: e_1_2_1_12_2 article-title: The performance of plastic‐encapsulated CMOS Microcircuits in a humid environment publication-title: IEEE CHMT – ident: e_1_2_1_15_2 doi: 10.1109/IRPS.1983.361988 – ident: e_1_2_1_24_2 – ident: e_1_2_1_4_2 doi: 10.1109/IRPS.1982.361941 – volume: 2 start-page: 95 year: 1984 ident: e_1_2_1_6_2 article-title: A review of the status of plastic encapsulated semiconductor component reliability publication-title: British Telecom Technical Journal – ident: e_1_2_1_8_2 – ident: e_1_2_1_19_2 – ident: e_1_2_1_23_2 doi: 10.1149/1.2134003 – volume: 18 start-page: 1 year: 1978 ident: e_1_2_1_22_2 article-title: The mechanisms of elevated temperature property losses in high performance structural epoxy resin matrix materials after exposure to high humidity environments publication-title: Polymer Engineering and Science – volume: 132 start-page: 74 issue: 3 year: 1985 ident: e_1_2_1_3_2 article-title: Failure modes and mechanisms for VLSI ICs—a review publication-title: IEE Proceedings – ident: e_1_2_1_5_2 – ident: e_1_2_1_13_2 doi: 10.1109/IRPS.1985.362090 – ident: e_1_2_1_20_2 doi: 10.1007/978-94-009-4942-3 – ident: e_1_2_1_2_2 – ident: e_1_2_1_18_2 – ident: e_1_2_1_9_2 – ident: e_1_2_1_10_2 – ident: e_1_2_1_11_2 doi: 10.1109/IRPS.1979.362880 – ident: e_1_2_1_14_2 doi: 10.1109/IRPS.1985.362097 |
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| Snippet | The equipment and associated methodology of a new technique for checking the susceptibility of plastic‐encapsulated ICs to moisture ingress is presented. The... The equipment and associated methodology of a new technique for checking the susceptibility of plastic-encapsulated ICs to moisture ingress is presented. The... |
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| SubjectTerms | Applied sciences Electronics Exact sciences and technology IC reliability Microelectronic fabrication (materials and surfaces technology) Plastic encapsulated integrated circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices |
| Title | A rapid technique for assessing the moisture ingress susceptibility of plastic-encapsulated integrated circuits |
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