A rapid technique for assessing the moisture ingress susceptibility of plastic-encapsulated integrated circuits

• Published in: Quality and reliability engineering international Vol. 3; no. 3; pp. 185 - 193
• Main Authors: Chwastek, E. J., Shaw, R. N.
• Format: Journal Article
• Language: English
• Published: Chichester Wiley Subscription Services, Inc., A Wiley Company 01.07.1987; Wiley
• Subjects: Applied sciences; Electronics; Exact sciences and technology; IC reliability; Microelectronic fabrication (materials and surfaces technology); Plastic encapsulated integrated circuits; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Processing control; Encapsulation; Lifetime; Integrated circuit; Package; Plastics; Moisture test
• ISSN: 0748-8017; 1099-1638
• DOI: 10.1002/qre.4680030309

The equipment and associated methodology of a new technique for checking the susceptibility of plastic‐encapsulated ICs to moisture ingress is presented. The basis of the new technique is to immerse unbiased ICs in a salt solution and to subject them to high temperatures (in the range 120°C to 175°C) and to high pressures (2 to 9 atmospheres). At the highest temperature, results can be obtained within a few hours, although a 20 h test at 165°C is suggested as a screen for components. The test is extremely simple to carry out and a testing facility can be quickly established. Using CMOS components from five different vendors, good agreement has been obtained between the results from the new test and the results from a biased 85°C/85 percent RH test.