Electrodeposition of Copper from EDTA Complex Solution and Properties of the Deposit

The throwing power of Cu (II) -EDTA plating baths containing a large quantity of glycine and potassium chloride, and the physical properties of the films obtained were investigated. The addition of potassium chloride was found to increase the specific conductivity of the baths, resulting in an incre...

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Bibliographic Details
Published inHyōmen gijutsu Vol. 41; no. 2; pp. 156 - 160
Main Authors MIZUMOTO, Shozo, NAWAFUNE, Hidemi, KOJIMA, Tamao, HAGA, Masaki, SONODA, Tsukasa
Format Journal Article
LanguageEnglish
Published Tokyo The Surface Finishing Society of Japan 01.02.1990
Japan Science and Technology Agency
Subjects
Copper Electrodeposition
Crystal Structure
EDTA Bath
Mechanical Property
Throwing Power
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Summary:The throwing power of Cu (II) -EDTA plating baths containing a large quantity of glycine and potassium chloride, and the physical properties of the films obtained were investigated. The addition of potassium chloride was found to increase the specific conductivity of the baths, resulting in an increase in throwing power. The films obtained were heat-treated for 1h at 160°C resulting in crystal growth and relief of lattice strain, and were shown to have nearly the same elongation and ultimate tensile strength as commercial high ductile electrolytic copper foil.
ISSN:0915-1869
1884-3409
DOI:10.4139/sfj.41.156