Imaging of Located Buried Defects in Metal Samples by an Scanning Microwave Microscopy

• Published in: Procedia engineering Vol. 25; pp. 1637 - 1640
• Main Authors: Rossignol, J., Plassard, C., Bourillot, E., Calonne, O., Foucault, M., Lesniewska, E.
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 2011
• Subjects: Non-destructive method; Scanning microwave microscopy; Non-destructive method; Scanning microwave microscopy
• ISSN: 1877-7058; 1877-7058
• DOI: 10.1016/j.proeng.2011.12.405

A non-destructive method is proposed to detect the located buried defects using scanning microwave microscopy. Based on the “skin effect”, our recent developments authorize 3D tomography with nanometric resolution. This technique associates the electromagnetic microwave measurement using a Vector Network Analyzer (VNA) with the nanometer-resolution positioning capabilities of an Atomic Force Microscope. At each used frequency, an incident electromagnetic wave is send to the sample and the reflected wave gives information on a specific depth layer in the material. With a large bandwidth of frequencies, a 3D tomography is allowed inside the material. With characteristic tools of nanotechnology, different samples are developed with local buried defects. The result of the tomography applied on these samples and stainless steel samples (from Areva NP) are in accordance with the skin effect equation.