Material removal rate of 6H-SiC crystal substrate CMP using an alumina (Al 2 O 3 ) abrasive

Saved in:
Bibliographic Details
Published inJournal of semiconductors Vol. 33; no. 10; p. 106003
Main Authors Su, Jianxiu, Du, Jiaxi, Ma, Lijie, Zhang, Zhuqing, Kang, Renke
Format Journal Article
LanguageEnglish
Published 01.10.2012
Online AccessGet full text

Cover

More Information
ISSN:1674-4926
DOI:10.1088/1674-4926/33/10/106003