Material removal rate of 6H-SiC crystal substrate CMP using an alumina (Al 2 O 3 ) abrasive
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Published in | Journal of semiconductors Vol. 33; no. 10; p. 106003 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
01.10.2012
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Online Access | Get full text |
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ISSN: | 1674-4926 |
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DOI: | 10.1088/1674-4926/33/10/106003 |