High performance IZO:P/IZO:Ni thin film transistor with double active layers
•Amorphous IZO:P/IZO:Ni TFT was prepared by RF magnetron sputtering.•Double active layer IZO:P/IZO:Ni TFT was fabricated at low annealing temperature (T < 300 ℃).•IZO:P/IZO:Ni TFT showed an excellent performance with a mobility of 44.5 cm2 v−1 s−1. Staggered bottom-gate thin film transistor (TFT)...
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Published in | Materials letters Vol. 352; p. 135162 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
Elsevier B.V
01.12.2023
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Subjects | |
Online Access | Get full text |
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Summary: | •Amorphous IZO:P/IZO:Ni TFT was prepared by RF magnetron sputtering.•Double active layer IZO:P/IZO:Ni TFT was fabricated at low annealing temperature (T < 300 ℃).•IZO:P/IZO:Ni TFT showed an excellent performance with a mobility of 44.5 cm2 v−1 s−1.
Staggered bottom-gate thin film transistor (TFT) with double active layers was successfully fabricated. IZO:P/IZO:Ni thin films were deposited on SiO2/p-Si substrate by radio frequency (RF) magnetron sputtering, IZO:P/IZO:Ni acted as double active layers. The optical transmittance of IZO: P and IZO:Ni thin films were over 80% in the wavelength of 400–800 nm. X-ray diffraction (XRD) patterns exhibited that the IZO:P and IZO:Ni films were amorphous under the annealing temperature of 265 ℃. Atomic force microscopy (AFM) images showed that IZO:P and IZO:Ni thin films had a low root-mean-square (RMS) roughness of 0.44 nm and 0.45 nm, respectively. The annealing temperature was 265 ℃, the obtained TFT with IZO:P/IZO:Ni double active layers structure showed excellent electrical properties, including a saturation mobility of 44.5 cm2 v−1 s−1, a threshold voltage of 1.3 V, a subthreshold swing of 0.35 V/dec, and an on/off current ratio of 3.8 × 108. |
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ISSN: | 0167-577X 1873-4979 |
DOI: | 10.1016/j.matlet.2023.135162 |