Effects of a Ni alloying element on Al-Ni metallization

• Published in: Semiconductor science and technology Vol. 27; no. 1; pp. 15021 - 15026
• Main Authors: Lee, K W, Han, D M, Jeong, K H, Lee, K B, Lee, J G, Jeong, C O, Bae, Y H, Ruh, H, Kim, C S, Lee, E G
• Format: Journal Article
• Language: English
• Published: Bristol IOP Publishing 11.01.2012; Institute of Physics
• Subjects: Condensed matter: electronic structure, electrical, magnetic, and optical properties; Electrical properties of specific thin films; Electronic structure and electrical properties of surfaces, interfaces, thin films and low-dimensional structures; Exact sciences and technology; metallization; Metals and metallic alloys; Ni alloy; Physics; Grain size; High strain; Annealing; Aluminium base alloys; Electrical conductivity; Nickel alloys; Metallizing; Elastic deformation; Texture; Thin films; Arrhenius equation; Property structure relationship; Supersaturated solid solution

The effect of the Ni content (2-18 at.% Ni) in Al thin films on their resistivity, hillock formation and Al3Ni compound formation was investigated. The as-deposited Al-Ni-alloy films showed high elastic strains which increased with increasing Ni content. In addition, the annealing of the supersatura...