Precipitation behavior and electrical conductivity and mechanical properties of Cu-0.9Be-1.5Ni-0.04Y alloy
The optimum solid solution and aging processes for Cu-0.9Be-1.5Ni-0.04Y alloys, as well as the microstructure and strengthening mechanisms during aging were investigated. The results show that the optimum solid solution and aging temperatures are 980℃ and 480℃, respectively. During aging treatment a...
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Published in | Materials today communications Vol. 39; p. 108617 |
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Main Authors | , , , , , , , |
Format | Journal Article |
Language | English |
Published |
Elsevier Ltd
01.06.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The optimum solid solution and aging processes for Cu-0.9Be-1.5Ni-0.04Y alloys, as well as the microstructure and strengthening mechanisms during aging were investigated. The results show that the optimum solid solution and aging temperatures are 980℃ and 480℃, respectively. During aging treatment at 480°C, the precipitation sequence of the Cu-0.9Be-1.5Ni-0.04Y alloy was supersaturated α solid solution → GP zone → γ″ phase → γ′ phase → γ phase. As increasing the aging time, the microhardness and yield strength of the alloy showed a trend of increasing and then decreasing, with the maximum of 220.9 HV and 626 MPa, respectively. The strengthening mechanisms of the nanoscale γ" and γ' phases in Cu-0.9Be-1.5Ni-0.04Y alloy were the shear mechanism and orowan mechanism, respectively. The electrical conductivity of the alloy increased and then remained more or less constant with increasing aging time, with a maximum of 39.78%IACS. The difference between the theoretical and measured values of the electrical conductivity of the alloy after aging at 480℃ for different times was less than 1%.
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•The optimum solid solution and aging temperatures are 980℃ and 480℃, respectively.•The precipitation phase transformation rate is initially slow, then increases rapidly and finally slows down.•The variation between theoretical and measured electrical conductivity of alloy is within 1%. |
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ISSN: | 2352-4928 2352-4928 |
DOI: | 10.1016/j.mtcomm.2024.108617 |