RF balun embedded in multilayer organic substrate

This letter presents the design, modeling, and characterization of a RF balun embedded in multilayer organic substrate. A Marchand‐type balun for 2.4‐GHz Bluetooth and WLAN applications has been designed and fabricated using the low cost organic package technology. Its four‐port measurement results...

Full description

Saved in:
Bibliographic Details
Published inMicrowave and optical technology letters Vol. 49; no. 2; pp. 473 - 475
Main Authors Ihm, Jae-Yong, Hwang, Kyu-Pyung
Format Journal Article
LanguageEnglish
Published Hoboken Wiley Subscription Services, Inc., A Wiley Company 01.02.2007
Subjects
baluns
embedded passives
multilayer organic substrate
Online AccessGet full text

Cover

More Information
Summary:This letter presents the design, modeling, and characterization of a RF balun embedded in multilayer organic substrate. A Marchand‐type balun for 2.4‐GHz Bluetooth and WLAN applications has been designed and fabricated using the low cost organic package technology. Its four‐port measurement results show good electrical performance and close correlation with full‐wave simulation data demonstrating the successful implementation of the RF passive component completely integrated in build‐up layers of an organic package substrate. © 2006 Wiley Periodicals, Inc. Microwave Opt Technol Lett 49: 473–475, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.22163
Bibliography:ArticleID:MOP22163
istex:3C2C0677E3B386791E8F25429AB75F13997879B2
ark:/67375/WNG-LHB7HNZ8-0
ObjectType-Article-2
SourceType-Scholarly Journals-1
ObjectType-Feature-1
content type line 23
ISSN:0895-2477
1098-2760
DOI:10.1002/mop.22163