Temperature dependence of the structure and shear response of a Σ11 asymmetric tilt grain boundary in copper from molecular-dynamics

• Published in: Philosophical magazine (Abingdon, England) Vol. 92; no. 34; pp. 4320 - 4333
• Main Authors: Fensin, S.J., Asta, M., Hoagland, R.G.
• Format: Journal Article
• Language: English
• Published: Abingdon Taylor & Francis Group 01.12.2012; Taylor & Francis
• Subjects: Condensed matter: structure, mechanical and thermal properties; Defects and impurities in crystals; microstructure; Exact sciences and technology; Grain and twin boundaries; Grain boundary; Physics; shear response; structure; Structure of solids and liquids; crystallography; temperature effect; Grain boundaries; Temperature dependence; Crystal defects; Shear; Molecular dynamics method; Roughness; Molecular dynamics; Theoretical study; Tilt boundaries; Shear strength; Melting points; Temperature effects; Embedded atom method; Copper; Microstructure; Classical theory
• ISSN: 1478-6435; 1478-6443
• DOI: 10.1080/14786435.2012.705911

We investigate the effect of temperature on the structure and shear response of a Σ11 asymmetric tilt grain boundary in a classical embedded-atom model of elemental copper using molecular dynamics simulations. As the temperature is increased the structure of the boundary disorders considerably, but with a boundary width that remains finite at the melting point. The disordering of the boundary structure becomes significant for homologous temperatures above 0.83 (1100 K). As temperature increases above this point the boundary width and roughness increases monotonically. Near the temperature where the boundary starts to disorder we observe a change in the temperature dependence of the ideal shear strength of the boundary, as well as the value of the coupling parameter β, defined as the ratio of the velocity of relative translation of the grains parallel to the boundary plane to that corresponding to the motion of the boundary normal to its plane.