Modeling and characterization of wire bonding for RF applications

• Published in: 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) pp. 905 - 909
• Main Authors: Lu, A.C.W., Wei Fan, Wai, L.L., Low, L.A., Ke, F.X., Yip, K.C., Lim, Y.P.
• Format: Conference Proceeding
• Language: English
• Published: Piscataway NJ IEEE 2002
• Subjects: Applied sciences; Bonding; Design methodology; Design optimization; Design. Technologies. Operation analysis. Testing; Electromagnetic analysis; Electronics; Exact sciences and technology; Impedance; Integrated circuits; Radio frequency; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices; Space exploration; Space technology; Topology; Wire; Metallic bond; Electrical wire; Mismatching; Modeling; Electromagnetic wave; BGA technology; Optimization; Integrated circuit bonding; Interconnection; Electronic packaging; Soldered joint; Integrated circuit; Chip-on-board packaging; Impedance; Electrical characteristic
• ISBN: 9780780374300; 0780374304
• ISSN: 0569-5503; 2377-5726
• DOI: 10.1109/ECTC.2002.1008207

This paper describes a design methodology for improving the electrical performance of wire bonding. Adjacent power or ground wires are used to provide return paths in a coplanar configuration, thereby minimizing impedance mismatch. Design space exploration based on full-wave electromagnetic analysis is performed to achieve an optimized topology. The methodology has been demonstrated for both parallel and fanout bonding topologies for high frequencies up to 10 GHz. With advances in wire bonding technology, particularly fine pitch bonding, a coplanar configuration is highly feasible. The proposed methodology can be applied to lead frame, leadless chip carrier, COB and advanced BGA packages.