Optoelectronic Package Having Low-Loss Optical Waveguide Hole With Core-Clad Structure for Chip-to-Chip Interconnection

• Published in: IEEE photonics technology letters Vol. 20; no. 24; pp. 2033 - 2035
• Main Authors: Takagi, Y., Ohno, T., Horio, T., Suzuki, A., Kojima, T., Takada, T., Iio, S., Obayashi, K., Okuyama, M.
• Format: Journal Article
• Language: English
• Published: New York IEEE 15.12.2008; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Connectors; Core-clad structure; Electromagnetic waveguides; High speed optical techniques; Optical devices; optical interconnection; Optical interconnections; Optical surface waves; optical waveguide holes; Optical waveguides; optoelectronic package; Packaging; passive alignment; Stimulated emission; Very large scale integration
• ISSN: 1041-1135; 1941-0174
• DOI: 10.1109/LPT.2008.2006058

We have developed optoelectronic packages having optical waveguide holes with core-clad structures for chip-to-chip optical interconnection within computer systems. A rate of 10-Gb/s/ch chip-to-chip optical signal transmission has been demonstrated. The optoelectronic package we have developed consists of two guide pins and four-channel optical waveguide holes. The two guide pins are used to align an optical fiber connector with an optical device. The optical waveguide holes are used to transmit optical signals vertically through the optoelectronic package. Using the optical waveguide holes in the optoelectronic package, and high-quality signal transmission has been achieved.