Microstructural studies of W–10wt.% Cu composites prepared by using ultrafine composite powder

• Published in: International journal of refractory metals & hard materials Vol. 45; pp. 76 - 79
• Main Authors: Sun, Benzhe, Song, Jiupeng, Yu, Yang, Zhuang, Zhigang, Niu, Mingjie, Liu, Yan, Zhang, Tinghui, Qi, Yang
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.07.2014
• Subjects: COMPOSITES; Copper; ELECTRICAL CONDUCTIVITY; Grain size; GRAIN SIZE AND SHAPE; Grains; MICROSTRUCTURES; Orientation relationship; Orientation relationships; PHASES; POWDERS; Refractory metals; RESIDUAL STRESS; Thermal conductivity; Tungsten–copper composites; Ultrafine composite powder; Grain size; Ultrafine composite powder; Orientation relationship; Residual stress; Tungsten–copper composites
• ISSN: 0263-4368; 2213-3917
• DOI: 10.1016/j.ijrmhm.2014.04.005

Tungsten–copper (W–Cu) composites containing 10wt.% Cu (W–10Cu) were prepared by pressing and sintering a type of ultrafine composite powder. Constituent phases, grain size and orientation relationship between W and Cu grains were characterized and investigated. The results show that W–10Cu composites are composed of W and Cu elementary substance and orientation relationship between W and Cu grains is defined as 1¯1¯4Cu//01¯1W and (131)Cu//(200)W. The existence of the orientation relationship depends largely on the two factors. First, the grain sizes of both W and Cu were in the nanoscale range. Secondly, the interplanar spacing between both phases can match well owing to the residual stress of the W/Cu interface. Consequently, the obtained composites exhibited high density and excellent thermal conductivity.