Fracture Phenomenon of Plastic Package during the Reflow Soldering Process

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Bibliographic Details
Published inKobunshi Vol. 42; no. 5; pp. 408 - 410
Main Author Yoshizumi, Akira
Format Journal Article
LanguageJapanese
English
Published The Society of Polymer Science, Japan 1993
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ISSN:0454-1138
2185-9825
DOI:10.1295/kobunshi.42.408