APA (7th ed.) Citation

Li, J., Tang, M., Wu, L., Jiang, L., Dai, W., & Mao, J. (2024). LB-ADI: An Efficient Method for Transient Thermal Simulation of Integrated Chiplets and Packages. IEEE journal on multiscale and multiphysics computational techniques, 9, 149-156. https://doi.org/10.1109/JMMCT.2024.3386842

Chicago Style (17th ed.) Citation

Li, Jie, Min Tang, Lin-Sheng Wu, Liguo Jiang, Wenliang Dai, and Junfa Mao. "LB-ADI: An Efficient Method for Transient Thermal Simulation of Integrated Chiplets and Packages." IEEE Journal on Multiscale and Multiphysics Computational Techniques 9 (2024): 149-156. https://doi.org/10.1109/JMMCT.2024.3386842.

MLA (9th ed.) Citation

Li, Jie, et al. "LB-ADI: An Efficient Method for Transient Thermal Simulation of Integrated Chiplets and Packages." IEEE Journal on Multiscale and Multiphysics Computational Techniques, vol. 9, 2024, pp. 149-156, https://doi.org/10.1109/JMMCT.2024.3386842.