LB-ADI: An Efficient Method for Transient Thermal Simulation of Integrated Chiplets and Packages

• Published in: IEEE journal on multiscale and multiphysics computational techniques Vol. 9; pp. 149 - 156
• Main Authors: Li, Jie, Tang, Min, Wu, Lin-Sheng, Jiang, Liguo, Dai, Wenliang, Mao, Junfa
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 2024; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Alternating direction implicit (adi) method; Basis functions; chiplet-based integration; Chiplets; Conduction heating; Conductive heat transfer; Heating systems; Laguerre-based method; Mathematical models; Method of moments; Packages; Sparse matrices; Testing; Thermal management; Thermal simulation; Time-domain analysis; Transient analysis; Transient heat conduction; transient thermal simulation
• ISSN: 2379-8815; 2379-8815
• DOI: 10.1109/JMMCT.2024.3386842

In this article, an efficient Laguerre-based alternating direction implicit (LB-ADI) approach is proposed for the transient thermal simulation of integrated chiplets and packages. The transient heat conduction equation is transformed into the Laguerre domain by the Laguerre basis functions and the Galerkin's testing method. With spatial discretization, the resulting matrix equation based on a marching-on-in-order scheme is established. In order to improve the computational efficiency, a new ADI approach in the Laguerre domain is developed. Only three tridiagonal matrices need to be solved in each order, which significantly reduces the simulation time and memory requirement. The accuracy and efficiency of the proposed method are validated by numerical results.