Compact Modeling for Average Power Handling Capabilities of Symmetric and Asymmetric Striplines

• Published in: IEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 13; no. 10; p. 1
• Main Authors: Zheng, Zehao, Tang, Min, Mao, Junfa
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 01.10.2023; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Asymmetry; Average power handling capability (APHC); Circuits; Conductors; Conformal mapping; Dielectric losses; Dielectrics; Equivalence; equivalent thermal circuit; Metal strips; Modelling; Stripline; Striplines; Strips; Substrates; Temperature dependence; Thermal conductivity; Thermal resistance
• ISSN: 2156-3950; 2156-3985
• DOI: 10.1109/TCPMT.2023.3304888

In this paper, a compact modeling for the average power handling capabilities (APHCs) of symmetric and asymmetric striplines is investigated. According to the principle of conformal mapping technique, the striplines are transformed into parallel-plate rectangular structures. The thermal resistances of the striplines are calculated straightforwardly by this means. The temperature rises and APHCs of the striplines are obtained through the equivalent thermal circuits, where different thermal boundaries, as well as the impact of temperature-dependent resistivity of the metal strip, are taken into account. The validity of the equivalent thermal circuit is demonstrated through electro-thermal co-simulation of striplines with different substrates and geometries. The results of the proposed model are in good agreement with those obtained by the commercial software.