Electromagnetic-Circuital-Thermal-Mechanical Multiphysics Numerical Simulation Method for Microwave Circuits

• Published in: IEEE journal on multiscale and multiphysics computational techniques Vol. 9; pp. 129 - 141
• Main Authors: Zhang, Huan Huan, Jia, Zheng Lang, Zhang, Peng Fei, Liu, Ying, Jiang, Li Jun, Ding, Da Zhi
• Format: Journal Article
• Language: English
• Published: Piscataway IEEE 2024; The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
• Subjects: Aerospace environments; Circuit design; Computational modeling; Computer simulation; Coupling; discontinuous Galerkin time-domain method; Electromagnetic heating; Electromagnetic pulses; Electromagnetics; Finite element analysis; Finite element method; High power microwaves; Method of moments; Microwave circuits; Microwave FET integrated circuits; Microwave integrated circuits; Microwave theory and techniques; Microwave transistors; Multiphysics simulation; Numerical methods; Physics computing; Thermal simulation; Time domain analysis
• ISSN: 2379-8815; 2379-8815
• DOI: 10.1109/JMMCT.2024.3372619

A electromagnetic-circuital-thermal-mechanical mu- ltiphysics numerical method is proposed for the simulation of microwave circuits. The discontinuous Galerkin time-domain (DGTD) method is adopted for electromagnetic simulation. The time-domain finite element method (FEM) is utilized for thermal simulation. The circuit equation is applied for circuit simulation. The mechanical simulation is also carried out by FEM method. A flexible and unified multiphysics field coupling mechanism is constructed to cover various electromagnetic, circuital, thermal and mechanical multiphysics coupling scenarios. Finally, three numerical examples emulating outer space environment, intense electromagnetic pulse (EMP) injection and high power microwave (HPM) illumination are utilized to demonstrate the accuracy, efficiency, and capability of the proposed method. The proposed method provides a versatile and powerful tool for the design and analysis of microwave circuits characterized by intertwined electromagnetic, circuital, thermal and stress behaviors.