Application of Polyamides Containing Disulfide Bonds to Copper Corrosion Inhibitor

• Published in: Hyōmen gijutsu Vol. 49; no. 7; pp. 790 - 791
• Main Authors: TSUTSUMI, Hiromori, TAKEOKA, Kenji, ONIMURA, Kenjiro, OISHI, Tsutomu
• Format: Journal Article
• Language: English; Japanese
• Published: Tokyo The Surface Finishing Society of Japan 01.07.1998; Japan Science and Technology Agency
• Subjects: Copper Corrosion; Corrosion Inhibitor; Disulfide; Polyamide
• ISSN: 0915-1869; 1884-3409
• DOI: 10.4139/sfj.49.790

The organic composites which contain functional group materials with sulfur contents do uniquely bond to metallic substrates such as gold and form a dense self collection structured film as has been reported in the past. Since then numerous application cases of such use for ornamental metallic surface and electrical terminals and the same have been seen. Also on a molecular basis research works are done regarding the corrosion resistance for copper in this respect. The current report discusses author's endeavor in synthesizing a polyamide that contains disulfide in its chain then investigate its effects as a corrosion resistance agent. To confirm the structure of these polyamides for each the IR, NMR and other spectral analysis are carried out. The polyamides are coated over plastics which are buffed, washed in acetone and pure water in ultrasonic cleaner. Polarization measurement is done. FTIR measurement showed a peak of 1650 Cm exp -1 and 1540 Cm exp -1 for the polyamides for which the curves are plotted.