Impact of Line Mismatch on Two-Wire Deembedding Methods in Early Characterization of Emerging Interconnects

In this paper, we analyze the impact of line mismatch on two-wire deembedding methods in early characterization of emerging interconnects. According to our analysis, mismatch of wires significantly reduces the accuracy of deembedding methods using two test wire structures and causes unexpectedly lar...

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Bibliographic Details
Published inIEEE transactions on components, packaging, and manufacturing technology (2011) Vol. 9; no. 5; pp. 905 - 912
Main Authors Choi, Minsoo, Kim, Taehee, Lim, Kyunghyun, Kim, Byungsub
Format Journal Article
LanguageEnglish
Published Piscataway IEEE 01.05.2019
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Characterization
deembedding
emerging interconnects
Impact analysis
Information and communication technology
Integrated circuit interconnections
Interconnections
interposers
line mismatch
Packaging
Reliability theory
Test procedures
Wire
Wires
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Summary:In this paper, we analyze the impact of line mismatch on two-wire deembedding methods in early characterization of emerging interconnects. According to our analysis, mismatch of wires significantly reduces the accuracy of deembedding methods using two test wire structures and causes unexpectedly large error. Therefore, characterizing emerging interconnects with the deembedding methods is not reliable in an early development period when the process variation is large. To help engineers to decide whether the deembedding methods are applicable or not, we theoretically and empirically analyze how line mismatch affects the deembedding accuracy, and derive a condition under which the deembedding methods are reliable.
ISSN:2156-3950
2156-3985
DOI:10.1109/TCPMT.2018.2844871