A Wideband Substrate Integrated Filtering Dielectric Resonator Antenna for Millimeter-Wave Applications
In this letter, a wideband substrate integrated dielectric resonator antenna (SIDRA) with filtering response for millimeter-wave (mm-wave) applications is proposed. The antenna contains a dual-mode substrate integrated dielectric resonator (SIDR), which is fed by a slot-coupled double-T-shaped micro...
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Published in | IEEE antennas and wireless propagation letters Vol. 23; no. 2; pp. 1 - 5 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
New York
IEEE
01.02.2024
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
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Summary: | In this letter, a wideband substrate integrated dielectric resonator antenna (SIDRA) with filtering response for millimeter-wave (mm-wave) applications is proposed. The antenna contains a dual-mode substrate integrated dielectric resonator (SIDR), which is fed by a slot-coupled double-T-shaped microstrip feeding structure. The stacked substrates with the peripheral air vias and a metallic via cavity are the main body of the SIDR, which ensure dual-mode operation with the TE111 mode and the TE131 mode. The pair of strips, the small patches with shorting pins and the two center air vias are the accessory parts of the SIDR, which play roles of converting the TE131 mode into the perturbed-TE131 mode, providing radiation nulls, and improving the out-of-band suppression level. The double-T-shaped feeding structure has two pairs of stubs with different lengths, providing a radiation null and a reflection zero, improving the impedance matching of the slot resonant mode and enhancing the suppression level at the upper stopband. For demonstration, a prototype of 1×4 array is designed and measured. The prototype operating at 24 GHz has a 10-dB impedance matching bandwidth of 34% (19.8-27.9 GHz), a peak gain of 13.1 dBi, and an out-of-band suppression level of about 21 dB. |
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ISSN: | 1536-1225 1548-5757 |
DOI: | 10.1109/LAWP.2023.3328873 |