Mechanical response of PCB assemblies during infrared reflow soldering

A finite element structural model is developed to predict the thermomechanical behavior of printed circuit board (PCB) assemblies during infrared reflow soldering. Specifically, the model predicts the amount of board warpage, the effects of increased PCB assembly stiffness resulting from the solder...

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Bibliographic Details
Published inIEEE transactions on components, packaging, and manufacturing technology. Part A Vol. 19; no. 1; pp. 127 - 133
Main Authors Mittal, S., Masada, G.Y., Bergman, T.L.
Format Journal Article
LanguageEnglish
Published IEEE 01.03.1996
Subjects
Assembly
Copper
Lead
Packaging
Printed circuits
Reflow soldering
Semiconductor device modeling
Temperature
Thermal stresses
Thermomechanical processes
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Summary:A finite element structural model is developed to predict the thermomechanical behavior of printed circuit board (PCB) assemblies during infrared reflow soldering. Specifically, the model predicts the amount of board warpage, the effects of increased PCB assembly stiffness resulting from the solder joint formation, and the size of gaps generated at the module lead solder pad interface. In this paper, quantitative estimates of these process-induced variables are provided as well as a description of the approach used for the analyses.
ISSN:1070-9886
1558-3678
DOI:10.1109/95.486624