Measurement of dielectric anisotropy of BPDA-PDA polyimide in multilayer thin-film packages
The measured dielectric anisotropy of BPDA-PDA polyimide, obtained from a specially designed test vehicle, is presented. The multilayer thin-film structure is representative of its actual use in multichip carrier (MCM-D) applications both from the cross sectional dimensions and fabrication sequence...
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Published in | IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging Vol. 17; no. 4; pp. 486 - 492 |
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Main Authors | , , , , , , , , , , , |
Format | Journal Article |
Language | English |
Published |
IEEE
01.11.1994
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Subjects | |
Online Access | Get full text |
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Summary: | The measured dielectric anisotropy of BPDA-PDA polyimide, obtained from a specially designed test vehicle, is presented. The multilayer thin-film structure is representative of its actual use in multichip carrier (MCM-D) applications both from the cross sectional dimensions and fabrication sequence point of view. Modeling is performed using finite-element and electromagnetic techniques and the effect of anisotropy on signal propagation and crosstalk are verified through time-domain measurements.< > |
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ISSN: | 1070-9894 1558-3686 |
DOI: | 10.1109/96.338713 |