Measurement of dielectric anisotropy of BPDA-PDA polyimide in multilayer thin-film packages

The measured dielectric anisotropy of BPDA-PDA polyimide, obtained from a specially designed test vehicle, is presented. The multilayer thin-film structure is representative of its actual use in multichip carrier (MCM-D) applications both from the cross sectional dimensions and fabrication sequence...

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Published inIEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging Vol. 17; no. 4; pp. 486 - 492
Main Authors Deutsch, A., Swaminathan, M., Ree, M.-H., Surovic, C.W., Arjavalingam, G., Prasad, K., McHerron, D.C., McAllister, M., Kopcsay, G.V., Giri, A.P., Perfecto, E., White, G.E.
Format Journal Article
LanguageEnglish
Published IEEE 01.11.1994
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Summary:The measured dielectric anisotropy of BPDA-PDA polyimide, obtained from a specially designed test vehicle, is presented. The multilayer thin-film structure is representative of its actual use in multichip carrier (MCM-D) applications both from the cross sectional dimensions and fabrication sequence point of view. Modeling is performed using finite-element and electromagnetic techniques and the effect of anisotropy on signal propagation and crosstalk are verified through time-domain measurements.< >
ISSN:1070-9894
1558-3686
DOI:10.1109/96.338713