Impact of Bonding Layer Voids Distribution Uniformity on the Thermal Performance of Light-Emitting Diode

The voids distribution uniformity within the bonding layer has emerged as a critical factor affecting thermal reliability of light-emitting diodes (LEDs), while the absence of quantitative characterization poses challenges in accurately assessing its impact and optimized design. In this study, a cal...

Full description

Saved in:
Bibliographic Details
Published inIEEE transactions on electron devices Vol. 71; no. 3; pp. 1980 - 1986
Main Authors Yu, Binhai, Liu, Hesheng, Yuan, Yikai, Li, Jiasheng, Guo, Jianheng, Ding, Xinrui, Li, Zong-Tao
Format Journal Article
LanguageEnglish
Published New York IEEE 01.03.2024
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subjects
Bonding
Bonding layer voids
Coefficients
Conduction heating
Conductive heat transfer
Design optimization
junction temperature
Junctions
Light emitting diodes
light-emitting diode (LED)
Performance evaluation
Resistance
Substrates
thermal performance
Thermal resistance
Voids
voids distribution uniformity coefficient
Online AccessGet full text

Cover

More Information
Summary:The voids distribution uniformity within the bonding layer has emerged as a critical factor affecting thermal reliability of light-emitting diodes (LEDs), while the absence of quantitative characterization poses challenges in accurately assessing its impact and optimized design. In this study, a calculation method for the uniformity coefficient of the bonding layer voids distribution is proposed, revealing the impact of voids uniformity on the thermal performance of the device. We have investigated the influence of the number of voids and divided grids on the uniformity coefficient, establishing the criterion of saturated grid number. Results show that the decrease of the voids distribution uniformity coefficient leads to a lower thermal resistance and junction temperature, demonstrating that more uniformly distributed voids in the bonding layer are beneficial to improve the heat conduction path. This work reveals a significant correlation between the thermal performance of LED devices and the voids distribution uniformity coefficient, providing valuable insights for understanding and controlling the voids distribution to achieve effective heat dissipation of such devices.
ISSN:0018-9383
1557-9646
DOI:10.1109/TED.2024.3351109