Properties of a Sandwich Thermal Insulation Composite with Silica Aerogel

Properties of a new type of sandwich composite based on magnesium board, silica aerogel thermal insulation layer, and water vapour barrier are experimentally analysed in the paper. For the basic characterization of the studied material, bulk density, matrix density, and total open porosity are measu...

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Published inKey Engineering Materials Vol. 707; pp. 114 - 121
Main Authors t, Jan, Pavlikova, Milena, Pokorny, Jaroslav, Trnik, Anton, Pavlik, Zbysek
Format Journal Article
LanguageEnglish
Published Zurich Trans Tech Publications Ltd 01.09.2016
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Summary:Properties of a new type of sandwich composite based on magnesium board, silica aerogel thermal insulation layer, and water vapour barrier are experimentally analysed in the paper. For the basic characterization of the studied material, bulk density, matrix density, and total open porosity are measured. Among the thermal properties, thermal conductivity, thermal diffusivity, and volumetric heat capacity are accessed. Water vapour transmission properties are determined using the dry-cup and wet-cup arrangements of the cup method. In order to describe the liquid moisture transport, water absorption coefficient and apparent moisture diffusivity are calculated based on the data obtained from the free water intake experiment based on the sorptivity concept. Ability of the tested material to accumulate water vapour is described by the sorption and desorption isotherms measured using a dynamic vapour sorption device. Mechanical resistivity of the tested composite is characterized by its compressive and flexural strength. Additionally, in order to get information on material performance at high temperature exposure, simultaneous TG and DSC analysis is done. The obtained data gives clear evidence on sandwich performance and proved its applicability in interior thermal insulation systems.
Bibliography:Selected, peer reviewed papers from the International Conference on Mining, Material and Metallurgical Engineering 2016, April 15-17, 2016, Seoul, South Korea
ObjectType-Article-1
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ISBN:3038357499
9783038357490
ISSN:1013-9826
1662-9795
1662-9795
DOI:10.4028/www.scientific.net/KEM.707.114