Integrated Stacked Parallel Plate Shunt Capacitor for Millimeter-Wave Systems in Low-Cost Highly Integrated CMOS Technologies
This letter presents a stacked parallel plate (SPP) shunt capacitor (SC) that benefits from metal stack increment with process nodes advancement. It demonstrated high quality (<inline-formula> <tex-math notation="LaTeX">Q </tex-math></inline-formula>) factor and hig...
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Published in | IEEE solid-state circuits letters Vol. 5; pp. 114 - 117 |
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Main Authors | , , , , |
Format | Journal Article |
Language | English |
Published |
Piscataway
IEEE
2022
The Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subjects | |
Online Access | Get full text |
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Summary: | This letter presents a stacked parallel plate (SPP) shunt capacitor (SC) that benefits from metal stack increment with process nodes advancement. It demonstrated high quality (<inline-formula> <tex-math notation="LaTeX">Q </tex-math></inline-formula>) factor and high self-resonance frequency (SRF), promoting the design of analog integrated circuits (ICs) in low-cost highly integrated CMOS technologies at the millimeter-wave (mm-wave) frequency range. As a proof-of-concept, an analytical-equation-based design method is also proposed and three ac-grounded capacitors: 300; 600; and 900-fF, are implemented in STMicroelectronics (STM) 55-nm process. Characterization is performed up to 100 GHz. An effective capacitance density of 0.8 <inline-formula> <tex-math notation="LaTeX">{\mathbf {fF}}/\mu \mathbf {m}^{\mathbf {2}} </tex-math></inline-formula> is obtained. Measurements show <inline-formula> <tex-math notation="LaTeX">Q </tex-math></inline-formula>-values reaching up to 14.7 at 100 GHz and equivalent input series resistances with flat wideband behavior reaching at most an average of 0.55 <inline-formula> <tex-math notation="LaTeX">\Omega </tex-math></inline-formula>. SRFs of 140 GHz for the 900-fF SPP-SC up to 368 GHz for the 300-fF SPP-SC are also determined from measurements: the highest SRFs for such large capacitances to the authors' knowledge. |
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ISSN: | 2573-9603 2573-9603 |
DOI: | 10.1109/LSSC.2022.3172992 |