APA (7th ed.) Citation

Cha, D., & Park, J. (2021). Impact of Dielectrics in SOI FinFET for Lower Power Consumption in Punch-through Current-based Local Thermal Annealing. Journal of semiconductor technology and science, 21(3), 222-228. https://doi.org/10.5573/JSTS.2021.21.3.222

Chicago Style (17th ed.) Citation

Cha, Dong-Woo, and Jun-Young Park. "Impact of Dielectrics in SOI FinFET for Lower Power Consumption in Punch-through Current-based Local Thermal Annealing." Journal of Semiconductor Technology and Science 21, no. 3 (2021): 222-228. https://doi.org/10.5573/JSTS.2021.21.3.222.

MLA (9th ed.) Citation

Cha, Dong-Woo, and Jun-Young Park. "Impact of Dielectrics in SOI FinFET for Lower Power Consumption in Punch-through Current-based Local Thermal Annealing." Journal of Semiconductor Technology and Science, vol. 21, no. 3, 2021, pp. 222-228, https://doi.org/10.5573/JSTS.2021.21.3.222.