Experimental study on ultrasonic vibration-assisted diamond wire sawing of sic

The diamond wire saw, known for its narrow kerf and excellent flexibility, is widely used in the cutting of hard and brittle materials. Additionally, by incorporating an ultrasonic vibration device, the processing efficiency can be significantly enhanced, and surface roughness can be reduced, making...

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Bibliographic Details
Published inJournal of physics. Conference series Vol. 3032; no. 1; pp. 12016 - 12022
Main Authors Yao, Chao, Zhao, Ligang, Zhu, Jiajun
Format Journal Article
LanguageEnglish
Published Bristol IOP Publishing 01.06.2025
Subjects
Brittle materials
Brittleness
Diamond machining
Kerf
Sawing
Surface properties
Surface roughness
Ultrasonic vibration
Wire
Workpieces
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Summary:The diamond wire saw, known for its narrow kerf and excellent flexibility, is widely used in the cutting of hard and brittle materials. Additionally, by incorporating an ultrasonic vibration device, the processing efficiency can be significantly enhanced, and surface roughness can be reduced, making it more advantageous for processing hard and brittle materials. This paper introduces the specific structure of the diamond wire saw ultrasonic composite processing system and the method of ultrasonic addition. Experiments were conducted using SiC as the test subject, comparing ultrasonic vibration-assisted cutting with non-ultrasonic vibration. The results indicate that the addition of ultrasonic vibration to the workpiece significantly improves cutting efficiency and surface quality.
Bibliography:ObjectType-Article-1
SourceType-Scholarly Journals-1
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ISSN:1742-6588
1742-6596
DOI:10.1088/1742-6596/3032/1/012016