Ultrasonic Vibration in Leadframe for the Bondability for Au Wedge Bond

The in-situ inspection of ultrasonic vibration of wire bonder capillary was carried out using laser interferometer in order to analyze the formation of Au wedge bond. It was observed that the changes in ultrasonic vibration can be used to describe process of bonding formation. The loss of ultrasonic...

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Bibliographic Details
Published inMaterials Science Forum Vol. 857; pp. 83 - 86
Main Authors Abdullah, Shahrum, Harun, Fuaida, Ismail, Roslina, Jalar, Azman
Format Journal Article
LanguageEnglish
Published Pfaffikon Trans Tech Publications Ltd 01.05.2016
Subjects
Bonding
Bonding strength
Formations
Inspection
Ultrasonic vibration
Waveforms
Wedges
Wire
Bondability
Ultrasonic Vibration
Wire Bonding
Au Wedge Bond
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Summary:The in-situ inspection of ultrasonic vibration of wire bonder capillary was carried out using laser interferometer in order to analyze the formation of Au wedge bond. It was observed that the changes in ultrasonic vibration can be used to describe process of bonding formation. The loss of ultrasonic energy was exhibited in ultrasonic vibration waveform of wire bonding on leadframe A. This observation is due to the low frictional energy and high deformation of Au wedge bond on leadframe A. The lower pull strength obtained by Au wedge bond further confirms the reduction of bond formation on leadframe A.
Bibliography:Selected peer reviewed papers from the 2015 International Conference on Advanced Materials Engineering and Technology (ICAMET 2015), December 4-5, 2015, Kaohsiung,Taiwan
ObjectType-Article-1
SourceType-Scholarly Journals-1
ObjectType-Feature-2
content type line 23
ISBN:9783035710205
3035710201
ISSN:0255-5476
1662-9752
1662-9752
DOI:10.4028/www.scientific.net/MSF.857.83