Laser-patterned epoxy-based 3D microelectrode arrays for extracellular recording

Microelectrode arrays are commonly used to study the electrophysiological behavior of cells. Recently, there has been a growing interest in fabricating three-dimensional microelectrode arrays. Here, we present a novel process for the fast fabrication of epoxy-based 3D microelectrode array platforms...

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Published inNanoscale Vol. 16; no. 30; pp. 14295 - 14301
Main Authors Peng, Hu, Kopic, Inola, Potfode, Shivani Ratnakar, Teshima, Tetsuhiko F, Boustani, George Al, Hiendlmeier, Lukas, Wang, Chen, Hussain, Mian Zahid, Özkale, Berna, Fischer, Roland A, Wolfrum, Bernhard
Format Journal Article
LanguageEnglish
Published England Royal Society of Chemistry 07.08.2024
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Summary:Microelectrode arrays are commonly used to study the electrophysiological behavior of cells. Recently, there has been a growing interest in fabricating three-dimensional microelectrode arrays. Here, we present a novel process for the fast fabrication of epoxy-based 3D microelectrode array platforms with the assistance of laser-patterning technology. To this end, we photopatterned 3D pillars as scaffolds using epoxy-based dry films. Electrodes and conductor traces were fabricated by laser patterning of sputtered platinum films on top of the 3D structures, followed by deposition of parylene-C for insulation. Microelectrodes at the tip of the 3D structures were exposed using a vertical laser ablation process. The final electrodes demonstrated a low impedance of ∼10 kΩ at 1 kHz in electrochemical impedance spectroscopy measurements under physiological conditions. We investigated the maximum compression force of the 3D structures, which could withstand approximately 0.6 N per pillar. The 3D microelectrode arrays were used to record extracellular signals from HL-1 cells in culture as a proof of principle. Our results show regular firing of action potentials recorded at the tip of the 3D structures, demonstrating the possibility of recording cell signals in non-planar environments.
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ISSN:2040-3364
2040-3372
2040-3372
DOI:10.1039/d4nr01727g