Critical assessment of thermal conductivity models for Miscibility Gap Alloy-based composite Phase Change Materials for high temperature Thermal Energy Storage

• Published in: Journal of physics. Conference series Vol. 2685; no. 1; pp. 12028 - 12035
• Main Authors: Molteni, M., Carraretto, I. M., Bassani, P., Gariboldi, E., Lucchini, A., Colombo, L. P. M.
• Format: Journal Article
• Language: English
• Published: Bristol IOP Publishing 01.01.2024
• Subjects: Alloys; Aluminum; Cooling rate; Energy storage; Finite element method; Heat conductivity; Heat transfer; High temperature; Magnesium base alloys; Mathematical models; Miscibility; Morphology; Phase change materials; Solidification; Thermal conductivity; Thermal energy; Thermal response
• ISSN: 1742-6588; 1742-6596
• DOI: 10.1088/1742-6596/2685/1/012028

Abstract Miscibility Gap Alloys (MGAs), such as Al-Sn-based systems, provide a viable solution for the development of composite Phase Change Materials (PCMs) for Thermal Energy Storage (TES) purposes. Their successful production depends on the cooling rate imposed to the melt. Finite Element Analyses (FEA), which relies also on thermal conductivity values, represent a powerful tool for the design of the production process. Thermal conductivity, which depends on the arrangement of the phases in the system, also affects the thermal response of the alloy. In the view of evaluating the impact of the phase morphology, the authors adapted some of the models developed for composites and solutions to Al-Sn and Al-Sn-Si-Mg alloys, characterized by broad solidification ranges in terms of composition and temperature and by significantly different phases thermal conductivity. In the fully-liquid range, Filippov and Novoselova model was selected for the description of both alloys. Models that consider sphere-like dispersions give values quite close to the theoretical upper Wiener bound when the high-melting phase is solid. The phase morphology impact is relevant when the solidification range is considered. The resulting arrangement-related thermal conductivity curves are compared to those supplied by CALPHAD-based software and to available literature data.