Application of Advanced Characterization Techniques to SmartSiC™ Product for Substrate-Level Device Performance Optimization

A review of the specific characterisation techniques developed and customized for SmartSiC™ substrates is given. A focus is made on thermal characterization of this engineered structure as well as its beneficial features with regards to bipolar degradation.

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Published inMaterials science forum Vol. 1124; pp. 27 - 34
Main Authors Zielinski, Marcin, Cela, Enrica, Radisson, Damien, Chapelle, Audrey, Schwarzenbach, Walter, Guiot, Eric, Simon, Roland B., Drouin, Alexis, Biard, Hugo
Format Journal Article
LanguageEnglish
Published Pfaffikon Trans Tech Publications Ltd 21.08.2024
Subjects
Performance degradation
Structural analysis
Substrates
Thermodynamic properties
Characterization
Thermal Simulation
Quality Control Plan
Wafer Bonding
Engineered Substrate
Thermal Boundary Resistance
Bipolar Degradation
SmartSiC
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Abstract A review of the specific characterisation techniques developed and customized for SmartSiC™ substrates is given. A focus is made on thermal characterization of this engineered structure as well as its beneficial features with regards to bipolar degradation.
AbstractList A review of the specific characterisation techniques developed and customized for SmartSiC™ substrates is given. A focus is made on thermal characterization of this engineered structure as well as its beneficial features with regards to bipolar degradation.
Author Simon, Roland B.
Chapelle, Audrey
Guiot, Eric
Schwarzenbach, Walter
Cela, Enrica
Biard, Hugo
Drouin, Alexis
Zielinski, Marcin
Radisson, Damien
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– givenname: Enrica
  surname: Cela
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  surname: Radisson
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  organization: Soitec S.A. : Chemin des Franques
– givenname: Audrey
  surname: Chapelle
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  organization: Soitec S.A. : Chemin des Franques
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– givenname: Roland B.
  surname: Simon
  fullname: Simon, Roland B.
  email: roland.simon@thermapsolutions.com
  organization: Thermap Solutions Ltd
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  fullname: Drouin, Alexis
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  organization: Soitec S.A. : Chemin des Franques
– givenname: Hugo
  surname: Biard
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  email: hugo.biard@soitec.com
  organization: Soitec S.A. : Chemin des Franques
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10.1002/9781118313534
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10.4028/p-026sj4
10.4028/p-krt011
10.1109/WiPDA46397.2019.8998802
10.4028/p-65127n
10.1109/96.311793
10.4028/p-628fu5
10.1038/s41598-022-17060-y
10.4028/p-777hqg
10.4028/p-4918s1
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Keywords Characterization
Thermal Simulation
Quality Control Plan
Wafer Bonding
Engineered Substrate
Thermal Boundary Resistance
Bipolar Degradation
SmartSiC
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Snippet A review of the specific characterisation techniques developed and customized for SmartSiC™ substrates is given. A focus is made on thermal characterization of...
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SubjectTerms Performance degradation
Structural analysis
Substrates
Thermodynamic properties
Title Application of Advanced Characterization Techniques to SmartSiC™ Product for Substrate-Level Device Performance Optimization
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Volume 1124
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