Temperature-dependent adhesive polymer-based composites with shape adaptability and low thermal contact resistance for thermal management

• Published in: Materials today communications Vol. 34; p. 105164
• Main Authors: Lei, Zhihui, Song, Chengyi
• Format: Journal Article
• Language: English
• Published: Elsevier Ltd 01.03.2023
• Subjects: PCLDA; Reversible adhesion; Shape memory; Thermal contact resistance; Thermal management; PCLDA; Reversible adhesion; Thermal management; Thermal contact resistance; Shape memory
• ISSN: 2352-4928; 2352-4928
• DOI: 10.1016/j.mtcomm.2022.105164

This work presents a new concept of incorporating temperature-dependent reversible adhesion and shape memory performances into the application of three-dimensional thermal management. Both the two performances root in the temperature-triggered crystallization characteristic of poly(ε-caprolactone) (PCL). The dynamic interfacial bonding helps to reduce the thermal contact resistance of polymer-based composites to 0.085 K·cm2·W−1, and the shape memory ability can be adapted to various heat sources with complex structures. The cooperation of adhesion and shape memory properties endows the PCL-based composites with more advantages than the traditional matrixes in a wide range of applications including thermal management, flexible electronics, and wearable devices. [Display omitted] •A dynamic interfacial adhesion of polymer composites via heating and cooling cycle.•Polymer composite with reduced thermal contact resistance.•Shape memory capability can adapt to the thermal management of 3D electronics.