Development and Electrical Properties of (Ca0.7Sr0.3) (Zr0.8Ti0.2)O3 Thin Film Applied to Embedded Decoupling Capacitors

A formed device embedded-type 0402 sized (Ca 0.7 Sr 0.3 ) (Zr 0.8 Ti 0.2 )O 3 (CSZT) embedded capacitor was fabricated for use in embedded printed circuit board. The capacitance and dielectric loss of the CSZT embedded capacitor were 406.1 pF and 0.015, respectively, at 1 MHz. The CSZT embedded capa...

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Published inIEEE electron device letters Vol. 35; no. 7; pp. 777 - 779
Main Authors LEE, Seung-Hwan, KIM, Hong-Ki, KANG, Min-Gyu, KANG, Chong-Yun, LEE, Sung-Gap, LEE, Young-Hie, YOON, Jung-Rag
Format Journal Article
LanguageEnglish
Published New York, NY IEEE 01.07.2014
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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Abstract A formed device embedded-type 0402 sized (Ca 0.7 Sr 0.3 ) (Zr 0.8 Ti 0.2 )O 3 (CSZT) embedded capacitor was fabricated for use in embedded printed circuit board. The capacitance and dielectric loss of the CSZT embedded capacitor were 406.1 pF and 0.015, respectively, at 1 MHz. The CSZT embedded capacitor exhibits stable capacitance with varying applied voltage and C Zero G (-55 °C-125 °C, delta C/C = ±30 ppm/°C) properties. The measured values of equivalent series resistance and equivalent series inductance were 6.1 Ω and 62.39 μH, respectively. The leakage current density was 0.78 μA/cm 2 at 3 V of applied voltage. These electrical properties indicate that the CSZT embedded capacitor holds promise for use as an embedded passive capacitor.
AbstractList A formed device embedded-type 0402 sized (Ca 0.7 Sr 0.3 ) (Zr 0.8 Ti 0.2 )O 3 (CSZT) embedded capacitor was fabricated for use in embedded printed circuit board. The capacitance and dielectric loss of the CSZT embedded capacitor were 406.1 pF and 0.015, respectively, at 1 MHz. The CSZT embedded capacitor exhibits stable capacitance with varying applied voltage and C Zero G (-55 °C-125 °C, delta C/C = ±30 ppm/°C) properties. The measured values of equivalent series resistance and equivalent series inductance were 6.1 Ω and 62.39 μH, respectively. The leakage current density was 0.78 μA/cm 2 at 3 V of applied voltage. These electrical properties indicate that the CSZT embedded capacitor holds promise for use as an embedded passive capacitor.
A formed device embedded-type 0402 sized (Ca0.7Sr0.3)(Zr0.8Ti0.2)O3 (CSZT) embedded capacitor was fabricated for use in embedded printed circuit board. The capacitance and dielectric loss of the CSZT embedded capacitor were 406.1 pF and 0.015, respectively, at 1 MHz. The CSZT embedded capacitor exhibits stable capacitance with varying applied voltage and C Zero G (-55 °C-125 °C, delta C/C [Formula Omitted] ppm/°C) properties. The measured values of equivalent series resistance and equivalent series inductance were 6.1 [Formula Omitted] and 62.39 [Formula Omitted]H, respectively. The leakage current density was 0.78 [Formula Omitted]A/cm[Formula Omitted] at 3 V of applied voltage. These electrical properties indicate that the CSZT embedded capacitor holds promise for use as an embedded passive capacitor. [PUBLICATION ABSTRACT]
Author Jung-Rag Yoon
Min-Gyu Kang
Chong-Yun Kang
Sung-Gap Lee
Seung-Hwan Lee
Young-Hie Lee
Hong-Ki Kim
Author_xml – sequence: 1
  givenname: Seung-Hwan
  surname: LEE
  fullname: LEE, Seung-Hwan
  organization: Department of Electronic Materials Engineering, Kwangwoon University, Seoul 139-701, Korea, Republic of
– sequence: 2
  givenname: Hong-Ki
  surname: KIM
  fullname: KIM, Hong-Ki
  organization: Department of Electronic Materials Engineering, Kwangwoon University, Seoul 139-701, Korea, Republic of
– sequence: 3
  givenname: Min-Gyu
  surname: KANG
  fullname: KANG, Min-Gyu
  organization: Electronic Materials Research Center, Future Convergence Research Division, Korea Institute of Science and Technology, Seoul 136-791, Korea, Republic of
– sequence: 4
  givenname: Chong-Yun
  surname: KANG
  fullname: KANG, Chong-Yun
  organization: Electronic Materials Research Center, Future Convergence Research Division, Korea Institute of Science and Technology, Seoul 136-791, Korea, Republic of
– sequence: 5
  givenname: Sung-Gap
  surname: LEE
  fullname: LEE, Sung-Gap
  organization: Department of Ceramic Engineering, Engineering Research Institute, Gyeongsang National University, Jinju 660-701, Korea, Republic of
– sequence: 6
  givenname: Young-Hie
  surname: LEE
  fullname: LEE, Young-Hie
  organization: Department of Electronic Materials Engineering, Kwangwoon University, Seoul 139-701, Korea, Republic of
– sequence: 7
  givenname: Jung-Rag
  surname: YOON
  fullname: YOON, Jung-Rag
  organization: Research and Development Center, Samwha Capacitor, Yongin 449-884, Korea, Republic of
BackLink http://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=28721676$$DView record in Pascal Francis
BookMark eNo9kE1LMzEQgIMoWD_ugpeACHrYNZ-b7FHa-gEFBevFy5JuJhrZbtZk-_L67420eJph5pkZ5jlC-33oAaEzSkpKSX2zmM9KRqgoGWeE1XIPTaiUuiCy4vtoQpSgBaekOkRHKX2STAolJuj_DP5BF4Y19CM2vcXzDtox-tZ0-DmGAeLoIeHg8NXUkFK9RFLya3z1lqNeelKy6yeOlx--x3e-W-PbYeg8WDwGPF-vwNqcz6ANm1zu3_HUDKb1Y4jpBB040yU43cVj9Ho3X04fisXT_eP0dlG0jFdjwY1lzkFlnVViJVumKXO1gloLYNYoS6xacSWdZpUmSjkqgKwcBeOE5gL4MbrY7h1i-NpAGpvPsIl9PtlQKWopuKQsU2RLtTGkFME1Q_RrE78bSppfv0322_z6bXZ-88jlbrFJ2ZaLpm99-ptjWjFaqSpz51vOA8Bfu9JU5F_4DxTBgo4
CODEN EDLEDZ
CitedBy_id crossref_primary_10_1038_srep10173
crossref_primary_10_1007_s10854_016_4874_x
Cites_doi 10.1016/S0038-1101(01)00190-3
10.1109/63.911139
10.1111/j.1744-7402.2012.02782.x
10.1116/1.589510
10.1016/S0022-3093(98)00853-9
10.1109/LED.2003.813381
10.4313/TEEM.2014.15.2.100
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10.1016/j.matlet.2010.09.065
10.1063/1.4851675
10.1109/TMTT.2002.807822
ContentType Journal Article
Copyright 2015 INIST-CNRS
Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Jul 2014
Copyright_xml – notice: 2015 INIST-CNRS
– notice: Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Jul 2014
DBID 97E
RIA
RIE
IQODW
AAYXX
CITATION
7SP
8FD
L7M
DOI 10.1109/LED.2014.2320295
DatabaseName IEEE All-Society Periodicals Package (ASPP) 2005-present
IEEE All-Society Periodicals Package (ASPP) 1998-Present
IEEE Xplore
Pascal-Francis
CrossRef
Electronics & Communications Abstracts
Technology Research Database
Advanced Technologies Database with Aerospace
DatabaseTitle CrossRef
Technology Research Database
Advanced Technologies Database with Aerospace
Electronics & Communications Abstracts
DatabaseTitleList
Technology Research Database
Database_xml – sequence: 1
  dbid: RIE
  name: IEEE/IET Electronic Library
  url: https://proxy.k.utb.cz/login?url=https://ieeexplore.ieee.org/
  sourceTypes: Publisher
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
Applied Sciences
EISSN 1558-0563
EndPage 779
ExternalDocumentID 3388003771
10_1109_LED_2014_2320295
28721676
6814281
Genre orig-research
GrantInformation_xml – fundername: Fundamental Research and Development Program for Core Technology of Materials
– fundername: Ministry of Trade, Industry and Energy (MOTIE) of Korea
GroupedDBID -~X
.DC
0R~
29I
4.4
5GY
5VS
6IK
97E
AAJGR
AASAJ
ABQJQ
ABVLG
ACGFO
ACIWK
ACNCT
AENEX
AETIX
AFFNX
AI.
AIBXA
AKJIK
ALLEH
ALMA_UNASSIGNED_HOLDINGS
ATWAV
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CS3
DU5
EBS
EJD
HZ~
IBMZZ
ICLAB
IFIPE
IFJZH
IPLJI
JAVBF
LAI
M43
O9-
OCL
P2P
RIA
RIE
RIG
RNS
TAE
TN5
TWZ
VH1
XFK
08R
ABFLS
IPNFZ
IQODW
AAYXX
CITATION
7SP
8FD
L7M
ID FETCH-LOGICAL-c236t-3ad2ffe6dfd74b5c2812f97e984e2da7d0d7b375f8268077f14e0bf1eaf4834e3
IEDL.DBID RIE
ISSN 0741-3106
IngestDate Thu Oct 10 17:12:52 EDT 2024
Fri Aug 23 03:01:29 EDT 2024
Tue Sep 20 22:38:34 EDT 2022
Wed Jun 26 19:28:12 EDT 2024
IsPeerReviewed true
IsScholarly true
Issue 7
Keywords CSZT
FDE
embedded capacitor
Dielectric loss
Printed circuit board
Thin film
Inductance
Decoupling
Capacitance
Leakage current
Printed circuit
Series resistance
Capacitor
Current density
Electrical characteristic
Language English
License CC BY 4.0
LinkModel DirectLink
MergedId FETCHMERGED-LOGICAL-c236t-3ad2ffe6dfd74b5c2812f97e984e2da7d0d7b375f8268077f14e0bf1eaf4834e3
PQID 1549543512
PQPubID 85488
PageCount 3
ParticipantIDs ieee_primary_6814281
pascalfrancis_primary_28721676
proquest_journals_1549543512
crossref_primary_10_1109_LED_2014_2320295
PublicationCentury 2000
PublicationDate 20140701
PublicationDateYYYYMMDD 2014-07-01
PublicationDate_xml – month: 07
  year: 2014
  text: 20140701
  day: 01
PublicationDecade 2010
PublicationPlace New York, NY
PublicationPlace_xml – name: New York, NY
– name: New York
PublicationTitle IEEE electron device letters
PublicationTitleAbbrev LED
PublicationYear 2014
Publisher IEEE
Institute of Electrical and Electronics Engineers
The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher_xml – name: IEEE
– name: Institute of Electrical and Electronics Engineers
– name: The Institute of Electrical and Electronics Engineers, Inc. (IEEE)
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References_xml – ident: ref13
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– ident: ref5
  doi: 10.1109/63.911139
– ident: ref3
  doi: 10.1111/j.1744-7402.2012.02782.x
– ident: ref12
  doi: 10.1116/1.589510
– ident: ref11
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– ident: ref2
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– ident: ref10
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– ident: ref8
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– ident: ref1
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– ident: ref7
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– ident: ref14
  doi: 10.1063/1.4851675
– ident: ref4
  doi: 10.1109/TMTT.2002.807822
SSID ssj0014474
Score 2.1833313
Snippet A formed device embedded-type 0402 sized (Ca 0.7 Sr 0.3 ) (Zr 0.8 Ti 0.2 )O 3 (CSZT) embedded capacitor was fabricated for use in embedded printed circuit...
A formed device embedded-type 0402 sized (Ca0.7Sr0.3)(Zr0.8Ti0.2)O3 (CSZT) embedded capacitor was fabricated for use in embedded printed circuit board. The...
SourceID proquest
crossref
pascalfrancis
ieee
SourceType Aggregation Database
Index Database
Publisher
StartPage 777
SubjectTerms Applied sciences
Capacitance
Capacitors
CSZT
Dielectric losses
Dielectric, amorphous and glass solid devices
Electrodes
Electronic equipment and fabrication. Passive components, printed wiring boards, connectics
Electronics
embedded capacitor
Exact sciences and technology
FDE
Leakage currents
Materials
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Title Development and Electrical Properties of (Ca0.7Sr0.3) (Zr0.8Ti0.2)O3 Thin Film Applied to Embedded Decoupling Capacitors
URI https://ieeexplore.ieee.org/document/6814281
https://www.proquest.com/docview/1549543512
Volume 35
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3Pb9MwFH4aO8GBARui25h84LBKS-Y4TpweUddqQgyQtkkTl8iOn1EFa1GXStP--r2XpFEZHDglUiwn9nP8fvi97wP44Ko0xyyVUVWgjEhfY2SDwShRxpB-dhpTLnC--JKfX-tPN9nNFpz0tTCI2CSfYcy3zVm-X1QrDpWd5gXjg5Gv86yQqq3V6k8MtG4Rl0lD0r4i-yNJOTr9PDnjHC4dKyYLZyaJDRXUcKpwRqS9o0kJLZvFXxtzo22mO3Cx_s42yeRnvKpdXD08gXD834G8gped2Sk-tuvkNWzh_A282AAj3IX7jfwhYedeTBqGHBai-MYh-yVjr4pFEMdjK2NzuSRXfCiOv9O1uJrJWA2_poJ5QMV09utWdPatqBdicuuQNjgvzsjZXXEN8A8xJi1dzZjrZw-up5Or8XnU8TJElUrzOkqtVyFg7oM32mUVjUSFkcFRoVF5a7z0xqUmC-S6FNKYkGiULiRoA4cuMX0L2_PFHN-BsOScW0ut0WXaBlskNrMNAg1SH2gHMFyLqvzdwm-UjdsiRyWJtWSxlp1YB7DLM9236yZ5AEd_yLZ_Tr6iSnKTD-BwLeyy-4HvSkauy8iUTNT-v7s9gOf88jZz9xC26-UK35N9UrujZmE-Aowl4Gw
link.rule.ids 315,786,790,802,27955,27956,55107
linkProvider IEEE
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwjV3Pb9MwFH6atgNwYMBAFMbwgcMqkcxxnDg9oq5VgXYg0UkTl8iJn1EFa1GXSoi_nveSNOoYB06JFMuy_Ry_H37v-wDeFGWcYhLLoMxQBqSvMbDeYBApY0g_FxpjLnCeXaSTS_3hKrnag7ddLQwi1slnGPJrfZfvVuWGQ2Vnacb4YOTrHJCel6ap1uruDLRuMJdJR9LJIrtLSTk4m47OOYtLh4rpwplLYkcJ1awqnBNpb2hZfMNncedorvXN-BBm25E2aSbfw01VhOXvv0Ac_3cqj-Bha3iKd81OeQx7uHwCD3bgCI_g104GkbBLJ0Y1Rw6LUXzmoP2a0VfFyovToZWh-bImZ7wvTr_SM5svZKj6n2LBTKBivPhxLVoLV1QrMboukI44J87J3d1wFfA3MSQ9XS6Y7ecpXI5H8-EkaJkZglLFaRXE1invMXXeGV0kJc1E-YHBQaZROWucdKaITeLJecmkMT7SKAsfofUcvMT4GewvV0t8DsKSe24ttcYi0dbbLLKJrTFokPpA24P-VlT5zwaAI68dFznISaw5izVvxdqDI17prl27yD04uSXb7jt5iypKTdqD462w8_YXvskZuy4hYzJSL_7d7Wu4N5nPpvn0_cXHl3CfB9Lk8R7DfrXe4CuyVqripN6kfwCHTuPA
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.genre=article&rft.atitle=Development+and+Electrical+Properties+of+%28Ca0.7Sr0.3%29+%28Zr0.8Ti0.2%29O3+Thin+Film+Applied+to+Embedded+Decoupling+Capacitors&rft.jtitle=IEEE+electron+device+letters&rft.au=LEE%2C+Seung-Hwan&rft.au=KIM%2C+Hong-Ki&rft.au=KANG%2C+Min-Gyu&rft.au=KANG%2C+Chong-Yun&rft.date=2014-07-01&rft.pub=Institute+of+Electrical+and+Electronics+Engineers&rft.issn=0741-3106&rft.eissn=1558-0563&rft.volume=35&rft.issue=7&rft.spage=777&rft.epage=779&rft_id=info:doi/10.1109%2FLED.2014.2320295&rft.externalDBID=n%2Fa&rft.externalDocID=28721676
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/lc.gif&issn=0741-3106&client=summon
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/mc.gif&issn=0741-3106&client=summon
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=/sc.gif&issn=0741-3106&client=summon