Changes of the Cu electrode real surface area during the process of electroless copper plating
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Published in | Journal of solid state electrochemistry Vol. 4; no. 6; pp. 337 - 341 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
04.07.2000
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Online Access | Get full text |
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ISSN: | 1432-8488 1433-0768 |
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DOI: | 10.1007/s100080000129 |