Strain gradients in Al-2% Cu thin films

The strain gradient through the thickness of 0.5-, 1.0-, and 2.0-mm-thick Al-2% Cu films on oxidized (001) Si wafers has been examined by using glancing-angle x-ray diffraction to measure the d spacing as a function of penetration depth of the incident x-ray beam. Samples with and without a 1-μm spu...

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Bibliographic Details
Published inJournal of applied physics Vol. 70; no. 4; pp. 2104 - 2110
Main Authors SHUTE, C. J, COHEN, J. B
Format Journal Article
LanguageEnglish
Published Woodbury, NY American Institute of Physics 15.08.1991
Subjects
Applied sciences
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Mechanical and acoustical properties of condensed matter
Metals. Metallurgy
Other topics in mechanical and acoustical properties of condensed matter
Physics
Gradient
Fourier transformation
Bragg diffraction
Grazing incidence
Experimental study
Coatings
X ray diffraction
Passivity
Dislocation density
Thickness
Stress relaxation
Thick film
Aluminium Copper Alloys
Residual stress
Binary alloy
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Summary:The strain gradient through the thickness of 0.5-, 1.0-, and 2.0-mm-thick Al-2% Cu films on oxidized (001) Si wafers has been examined by using glancing-angle x-ray diffraction to measure the d spacing as a function of penetration depth of the incident x-ray beam. Samples with and without a 1-μm sputtered quartz passivation layer were examined. The only gradient observed in these samples corresponded to surface relaxation in the unpassivated samples at depths of less than 50 Å. This result was verified by examining the shape of the diffraction peaks. The dislocation densities of the films were also determined from the peak shape.
ISSN:0021-8979
1089-7550
DOI:10.1063/1.349446