Scalable technologies for soft material-based devices towards flexible electronics

• Published in: Flexible and printed electronics Vol. 10; no. 2; pp. 23001 - 23016
• Main Authors: Fernandes, Jean Maria, Dutta, Soumya
• Format: Journal Article
• Language: English
• Published: IOP Publishing 01.06.2025
• Subjects: bilayer resist lithography; flexible electronics; high-resolution patterning; microelectronics-compatible; scalability
• ISSN: 2058-8585; 2058-8585
• DOI: 10.1088/2058-8585/addbee

Scalability is an essential criterion for technological advancement, especially in electronics, where high resolution is indispensable to creating precise features and circuits that boost device performance and functionality. Flexible electronics offers new possibilities but faces significant fabrication challenges in achieving miniaturization. Traditional photolithography, despite its high precision and maturity, faces challenges with flexible polymer substrates due to compatibility issues. This article provides a comprehensive review of the collective research efforts in our lab and introduces innovative fabrication technologies aimed at overcoming limitations in developing organic thin film transistors, polymer-based surface acoustic wave devices, and reduced graphene oxide -based nanoelectromechanical systems. Additionally, we extend this discussion to the current state of the art in scalable technologies for halide perovskite-based synaptic devices and present foundational results from our lab on flexible halide perovskite memristors, establishing a basis for further optimization. Moreover, additional advancements from both academia and industry are integrated into this discussion, offering a more inclusive perspective on the field. Our facile microelectronic-compatible fabrication methods, including robust polymer cross-linking, bilayer resist lithography using unconventional photoresist strippers, etc. enable sub-10 μ m feature size on soft-material-based electronic devices towards flexible applications. This work sets new benchmarks for scalable device fabrication and pushes the boundaries of flexible electronics.