A Novel Self-aligned Processing for Doubling the Integration Density of 3D NAND Flash Memory
In this paper, we propose a novel processing idea to double the number of cells in 3D NAND flash memory to overcome the stacking cell limit of conventional 3D NAND flash memory. We present a process integration flow primarily focused on selective etching, where the core innovation lies in using mate...
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Published in | Journal of semiconductor technology and science Vol. 25; no. 3; pp. 199 - 205 |
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Main Authors | , , , , , |
Format | Journal Article |
Language | English |
Published |
대한전자공학회
01.06.2025
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Subjects | |
Online Access | Get full text |
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