Chemical Repair of Plasma Damaged Porous Ultra Low-κ SiOCH Film Using a Vapor Phase Process

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Bibliographic Details
Published inJournal of the Electrochemical Society Vol. 157; no. 12; p. H1140
Main Authors Oszinda, Thomas, Schaller, Matthias, Schulz, Stefan E.
Format Journal Article
LanguageEnglish
Published 2010
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ISSN:0013-4651
DOI:10.1149/1.3503596