Synthesis of Titania-supported Copper Nanoparticles via Refined Alkoxide Sol-gel Process
Nanoparticles of titania and copper-loaded titania were synthesized by a refined sol-gel method using titanium butoxide. Unlike the conventional sol-gel procedure of adding water directly, the esterification of anhydrous butanol and glacial acetic acid provided the hydrolyzing water. In addition, ac...
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Published in | Journal of nanoparticle research : an interdisciplinary forum for nanoscale science and technology Vol. 3; no. 2-3; p. 113 |
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Main Authors | , , |
Format | Journal Article |
Language | English |
Published |
Dordrecht
Springer Nature B.V
01.06.2001
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Subjects | |
Online Access | Get full text |
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Summary: | Nanoparticles of titania and copper-loaded titania were synthesized by a refined sol-gel method using titanium butoxide. Unlike the conventional sol-gel procedure of adding water directly, the esterification of anhydrous butanol and glacial acetic acid provided the hydrolyzing water. In addition, acetic acid also served as a chelating ligand to stabilize the hydrolysis-condensation process and minimize the agglomeration of titania. Following the hydrolysis, Cu/TiO^sub 2^ was prepared by adding copper chloride to titania sol. The sol was dried, then calcined at 500^sup °^C to remove organics and transformed to anatase titania which was verified by XRD. Cu/TiO^sub 2^ was further hydrogen-reduced at 300^sup °^C. The recovery of Ti was exceeded by an average of 95% from titanium butoxide. TEM micrographs show that the Cu/TiO^sub 2^ particles are near uniform. The average crystallite sizes are 17-20 nm estimated from the peak broadening of XRD spectra. The bandgaps of TiO^sub 2^ and reduced Cu/TiO^sub 2^ range from 2.70 to 3.15 eV estimated from the diffusive reflective UV-Vis spectra. XPS analysis shows that Cu 2p^sub 3/2^ is 933.4 eV indicating primary Cu^sub 2^O form on the TiO^sub 2^ supports. The binding energy of Ti does not exhibit chemical shift suggesting negligible interaction of Cu cluster and TiO^sub 2^ support.[PUBLICATION ABSTRACT] |
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ISSN: | 1388-0764 1572-896X |
DOI: | 10.1023/A:1017553125829 |