Effects of stress on the temperature coefficient of frequency in double clamped resonators

This paper presents a theoretical framework for evaluating the temperature coefficient of frequency (TCf) of double clamped resonators due to stresses induced by the die and through die packaging. It is desirable to have a zero TCf such that the resonator frequency is stable over a broad temperature...

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Bibliographic Details
Published inThe 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05 Vol. 1; pp. 392 - 395 Vol. 1
Main Authors Melamud, R., Hopcroft, M., Jha, C., Bongsang Kim, Chandorkar, S., Candler, R., Kenny, T.W.
Format Conference Proceeding
LanguageEnglish
Published IEEE 2005
Subjects
Analytical models
Finite element methods
Material properties
Packaging
Resonant frequency
Softening
Temperature dependence
Temperature distribution
Thermal stresses
Transistors
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Summary:This paper presents a theoretical framework for evaluating the temperature coefficient of frequency (TCf) of double clamped resonators due to stresses induced by the die and through die packaging. It is desirable to have a zero TCf such that the resonator frequency is stable over a broad temperature range. The TCf depends on how the resonator's material properties, dimensions, and stresses change with temperature. A passive method of using thin film induced stresses in an encapsulated resonator to compensate for material softening is explored. By using a combination of finite element and analytical models it is possible to predict the TCf and improve thermal frequency stability of micromachined resonators.
ISBN:0780389948
9780780389946
ISSN:2159-547X
DOI:10.1109/SENSOR.2005.1496438