Electrochemical deposition of cobalt phosphorus for hard magnetic micro devices and the impact on magnetic anisotropy

• Published in: Journal of materials research and technology Vol. 33; pp. 2081 - 2092
• Main Authors: Wetzler, Felix, Nebel, Jan-Erik, Zhang, Wei, Urschel, Sven, Starke, Peter, Saumer, Monika
• Format: Journal Article
• Language: English
• Published: Elsevier B.V 01.11.2024
• Subjects: Crystal orientation; Grain size; Magnetic property; Morphology; Process-material-property correlation; Pulsed current; Magnetic property; Grain size; Pulsed current; Process-material-property correlation; Crystal orientation; Morphology
• ISSN: 2238-7854
• DOI: 10.1016/j.jmrt.2024.09.144

When fabricating magnetic components for micro-electro-mechanical systems, the intrinsic material properties as well as the magnetic anisotropy of the deposited material and the fabricated devices must be adjusted to the application. This work focuses on electrochemically deposited cobalt phosphorus layers from a sulfate-based electrolyte to be used as hard magnetic scales in position measurement systems. In preliminary tests round discs (5 mm diameter, 20 or 10 μm height) were fabricated, showing the influence of three process parameters (current density, pH-value and temperature) on the chemical composition and the magnetic behavior of the deposited cobalt phosphorus. Hereby deposition parameters to produce hard magnetic cobalt phosphorus are defined. Deposits with up to 6 wt.-% phosphorus show hard magnetic behavior, whereas deposits with more than 6 wt.-% show soft magnetic behavior. This is correlated with a transition from crystalline to amorphous structures. In further investigations arrays of micro scales (40 μm width, 10 μm height) were fabricated to show the influence of direct current and pulsed current on the properties of the deposits. Pulsed current increases coercive field strength by about 40 %, resulting in maximum values of 23 kA/m (in-plane) and 14 kA/m (out-of-plane). Remanence increases by about 30 %, resulting in maximum values of 0.40 T (in-plane) and 0.2 T (out-of-plane). Pulse plating changes preferred orientation from (110) to (100) and slightly increases grain size by about 20 %, resulting in an average grain size of 25 nm. [Display omitted] •Composition of the CoP deposits can be adjusted by varying process parameters.•P-content determines the magnetic behaviour of CoP deposits.•Simulations have shown that cracks lead to a decrease in the magnetic moment.•Pulse current leads to a change in the preferred orientation and in the grain size.•Deposition with pulsed current leads to an improvement in magnetic properties.